{"product_id":"2uul-fd40-chip-heating-glue-removal-station","title":"2UUL FD40 Chip Heating Glue Removal Station – Mobile Repair Preheater","description":"\u003cp class=\"MsoNormal\"\u003eThe 2UUL FD40 Chip Heating Glue Removal Station gives GSM technicians a compact, dedicated preheater for softening chip underfill before BGA disassembly. Built with a 16×17mm heating platform, it targets CPU, NAND flash, PMIC, and other BGA chips on mobile phone motherboards without disturbing nearby components. The recommended 150°C–200°C operating range softens hardened underfill glue, so you lift chips cleanly instead of forcing them off cold. This lowers the risk of pad lift, cracked chips, and PCB trace damage during reballing and rework jobs. Its compact, lightweight body fits easily on a crowded repair bench alongside your hot air station and microscope. For technicians handling daily IC change, jumper lagana, and chip-level repair work in Lahore, Karachi, and Islamabad workshops, this preheater speeds up safe disassembly and protects motherboard pads on every job.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46739634127009,"sku":"MST-SOLDERING-ACCESSORIES-1017","price":1500.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/2UUL-FD40-Chip-Heating-Glue-Removal-Station-1.webp?v=1784718730","url":"https:\/\/www.kbgsmstore.com\/products\/2uul-fd40-chip-heating-glue-removal-station","provider":"KB GSM Store","version":"1.0","type":"link"}