{"product_id":"amaoe-sam19-bga-ic-reballing-stencil","title":"Amaoe SAM19 BGA IC Reballing Stencil – Snapdragon SM8550\/SM8650 CPU Direct Heat Reballing Tool for Samsung S23\/S23 Ultra\/S24\/S24 Ultra","description":"\u003cp\u003eThe Amaoe SAM19 BGA IC Reballing Stencil gives your repair bench a direct-heat, 0.12mm precision template built for the Snapdragon SM8550 and SM8650 CPU layout used on Samsung Galaxy S23, S23 Ultra, S24, and S24 Ultra motherboards. You place the stencil over the cleaned CPU pads, apply solder paste, and heat it with your hot air station to form uniform solder balls without bridging or cold joints. High-quality steel construction resists warping under repeated heat cycles, so it holds its shape job after job on your workshop table. Whether the board came in with a dead-after-flash fault, boot loop issue, or hardware fault traced to the CPU, this stencil restores clean, reliable solder joints so the chip reflows back onto the board correctly.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47597933396129,"sku":"MST-SOLDERING-ACCESSORIES-1092","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-SAM19-BGA-IC-Reballing-Stencil-1.webp?v=1789683427","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-sam19-bga-ic-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}