{"product_id":"amaoe-u-gl1-bga-ic-reballing-stencil","title":"Amaoe U-GL1 BGA IC Reballing Stencil – 0.12mm CPU-Isolated Mixed Chipset Template","description":"\u003cp\u003eThe Amaoe U-GL1 BGA IC Reballing Stencil is a 0.12mm CPU-isolated mixed template built for technicians who work across multiple chipset families on the same repair bench. It supports precise ball placement for Exynos1080, Kirin980-HI3680, SM6450, SM7315\/7325, and SM8350 processors, so you keep one stencil instead of stocking separate tools for every board. The isolated cell layout stops solder bridging between adjacent pads during reballing, which matters most on a dead phone recovery where a single shorted joint restarts the whole fault. Made from durable stainless steel, the Amaoe U-GL1 handles repeated hot air cycles without warping, giving your workshop a reusable, cost-effective reballing solution.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47598330413217,"sku":"MST-SOLDERING-ACCESSORIES-1093","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-U-GL1-BGA-IC-Reballing-Stencil-1.webp?v=1789683656","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-u-gl1-bga-ic-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}