{"product_id":"amaoe-u-mixu3-0-12mm-qualcomm-snapdragon-mediatek-cpu-bga-reballing-stencil","title":"Amaoe U-MIXU3 0.12mm Qualcomm Snapdragon \u0026 MediaTek CPU Mixed BGA Reballing Stencil","description":"\u003cp\u003eThe Amaoe U-MIXU3 is a 0.12mm mixed BGA reballing stencil built for technicians who service both Qualcomm Snapdragon and MediaTek Dimensity flagship chipsets on one steel mesh plate. It covers Snapdragon 8 Elite Gen 5 SM8850, Snapdragon 7 Gen 4 SM7750, Snapdragon 8S Elite SM8735, Dimensity 9500-MT6993Z, and Dimensity 8400-MT6899Z ball patterns, so you don't need separate plates for Qualcomm and MediaTek boards. The 0.12mm aperture holds tin balls evenly across dense ball grid arrays, giving you clean, uniform reflow without bridging. Stainless steel construction resists heat warping under repeated hot air exposure, so the U-MIXU3 stays flat and accurate through daily workshop use.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47599612952737,"sku":"MST-SOLDERING-ACCESSORIES-1096","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-U-MIXU3-BGA-IC-Reballing-Stencil-1.webp?v=1789684387","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-u-mixu3-0-12mm-qualcomm-snapdragon-mediatek-cpu-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}