{"product_id":"amaoe-u-qsd13-bga-ic-reballing-stencil-snapdragon-8-elite","title":"Amaoe U-QSD13 BGA IC Reballing Stencil for Qualcomm Snapdragon 8 Elite CPU Rework","description":"\u003cp\u003eThe Amaoe U-QSD13 BGA IC Reballing Stencil gives you a precision-matched tin planting tool built for reballing the CPU package on Qualcomm SM8850, SM8750, and SM8735 chipsets, covering Snapdragon 8 Elite Gen5, 8 Elite, and 8S Elite boards. You place it directly over the CPU pads after IC removal, load fresh solder balls, and run your hot air station to reflow a clean, even joint. Its steel build handles repeated heating without warping, so your reballing stays accurate job after job. Every GSM technician working on flagship Snapdragon motherboards needs a stencil this exact on the bench.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47600575479969,"sku":"MST-SOLDERING-ACCESSORIES-1098","price":700.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-U-QSD13-BGA-IC-Reballing-Stencil-1.webp?v=1789684913","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-u-qsd13-bga-ic-reballing-stencil-snapdragon-8-elite","provider":"KB GSM Store","version":"1.0","type":"link"}