{"product_id":"amaoe-u-tensor-bga-ic-reballing-stencil","title":"Amaoe U-Tensor BGA IC Reballing Stencil for Google Pixel Tensor CPU Repair","description":"\u003cp\u003eThe Amaoe U-Tensor BGA IC Reballing Stencil is a precision stainless-steel tool built for reballing the Google Tensor CPU used in Pixel 6 series boards. Its fine aperture layout lines up exactly with the Tensor BGA pad map, so you get clean solder ball placement instead of guesswork on a dead-CPU job. Technicians reaching for this stencil are usually chasing a hang-on-logo fault, a boot loop, or a phone that stays dead after flash — all common signs of a CPU dry joint. Heat-resistant and reusable, it holds its shape through repeated hot air cycles, making it a dependable addition to any Pixel repair bench.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47597096272033,"sku":"MST-SOLDERING-ACCESSORIES-1090","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-U-Tensor-BGA-IC-Reballing-Stencil-1.webp?v=1789682843","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-u-tensor-bga-ic-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}