{"product_id":"amaoe-universal-2-0-bga-ic-reballing-stencil","title":"Amaoe Universal 2.0 BGA IC Reballing Stencil – Multi-Size 0.3mm\/0.35mm\/0.4mm\/0.5mm Stainless Steel Reballing Template for Mobile Repair","description":"\u003cp\u003eThe Amaoe Universal 2.0 BGA IC Reballing Stencil gives you one multi-size reballing template covering 0.3mm, 0.35mm, 0.4mm, and 0.5mm ball pitches, so you switch chip sizes on your repair bench without swapping tools between jobs. Built from stainless steel, it holds its shape through repeated hot air reflow cycles and keeps every reballing job consistent from the first use to the hundredth. The design includes both parallel-hole and 45-degree misaligned-hole layouts, letting you match the stencil pattern to the exact BGA package you are reballing — CPU, eMMC, UFS, or PMIC. You mount it directly over the chip, drop your solder balls, and reflow with confidence, cutting down on solder bridges and uneven balling.\u003c\/p\u003e","brand":"AMAOE","offers":[{"title":"Default Title","offer_id":47598785200289,"sku":"MST-SOLDERING-ACCESSORIES-1094","price":800.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Amaoe-Universal-2.0-BGA-IC-Reballing-Stencil-1.webp?v=1789683895","url":"https:\/\/www.kbgsmstore.com\/products\/amaoe-universal-2-0-bga-ic-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}