{"product_id":"mechanic-middle-layer-bga-reballing-platform-iphone-x-17-pro-max","title":"Mechanic Middle Layer Tin BGA Reballing Platform Set for iPhone X to 17 Pro Max","description":"\u003cp\u003eThe Mechanic Middle Layer Tin BGA Reballing Platform Set gives repair technicians a dedicated fixture for iPhone motherboard middle-layer tin planting, covering the full range from iPhone X through iPhone 17 Pro Max. A strong magnetic base holds the board and stencil securely in place while interchangeable steel mesh stencils guide solder ball placement for even, uniform reballing. Built for repair shops handling multiple iPhone generations, this set replaces the need for separate single-model fixtures, saving bench space and setup time. It supports motherboard mid-frame reballing after board-swap repairs, dead board recovery work, and general middle-layer solder joint restoration on modern iPhone logic boards.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46938707591329,"sku":"MST-SOLDERING-ACCESSORIES-1071","price":15000.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Mechanic--Middle-Layer-Tin-BGA-Reballing-Platform-Set-for-iPhone-X-to-17Pro-Max-3.webp?v=1787988946","url":"https:\/\/www.kbgsmstore.com\/products\/mechanic-middle-layer-bga-reballing-platform-iphone-x-17-pro-max","provider":"KB GSM Store","version":"1.0","type":"link"}