{"product_id":"relife-rl-601t-22-in-1-middle-layer-tin-planting-platform-iphone-x-15-pro-max","title":"RELIFE RL-601T 22 in 1 Middle Layer Tin Planting Platform – iPhone X to 15 Pro Max BGA Reballing Stencil Kit","description":"\u003cp\u003eThe RELIFE RL-601T is a 22-in-1 middle layer tin planting platform built for board-level technicians who reball motherboard ICs on iPhone X through 15 Pro Max. The kit pairs a high-temperature resistant synthetic stone base with 17 precision steel stencils and 5 module clamps, giving you round, evenly filled tin balls without mesh jamming. Anti-slip rubber feet keep the platform steady on your repair bench during reballing. A dependable fixture for CPU, PMIC, and other BGA chip tin planting work on modern iPhone boards.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46962685345953,"sku":"MST-SOLDERING-ACCESSORIES-1075","price":2500.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/Relife-RL-601T-15-series-middle-layer-tin-planting-platform-.fixture-.-steel-stencil-1.webp?v=1788393375","url":"https:\/\/www.kbgsmstore.com\/products\/relife-rl-601t-22-in-1-middle-layer-tin-planting-platform-iphone-x-15-pro-max","provider":"KB GSM Store","version":"1.0","type":"link"}