{"product_id":"ycs-07-mtk-bga-reballing-stencil","title":"YCS 07 MTK BGA CPU Reballing Stencil for MediaTek","description":"\u003cp class=\"MsoNormal\"\u003e\u003cspan lang=\"en-PK\"\u003eYCS 07 MTK BGA CPU Reballing Stencil is a precision repair stencil designed for MediaTek CPU chip reballing and motherboard-level mobile repair work. Part of the YCS MediaTek stencil series, Set 07 helps technicians apply solder paste accurately across matching BGA pad layouts during CPU rework. Its alloy-steel construction provides flexibility, heat resistance, and precise mesh alignment for professional chip repair. It is suitable for technicians handling CPU removal, reballing, reflow, and replacement jobs on compatible MediaTek-based mobile phone motherboards.\u003c\/span\u003e\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46867958202529,"sku":"MST-SOLDERING-ACCESSORIES-1034","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-07-MTK-Stencil-1_83e5c76c-6e2c-4c67-8d5e-5e249e9a41d4.webp?v=1786471269","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-07-mtk-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}