{"product_id":"ycs-11-qualcomm-bga-reballing-stencil","title":"YCS 11 Qualcomm BGA Reballing Stencil – Snapdragon CPU Comprehensive Network Stencil","description":"\u003cp\u003eThe YCS 11 Qualcomm BGA Reballing Stencil is a precision-engineered tin planting tool built for Snapdragon chipset reballing work on your repair bench. Part of the YCS Comprehensive Network series, it gives technicians accurate ball alignment for CPU, PMIC, and RF IC reballing. It's a practical pick for dead phone repair, hardware fault diagnosis, and board-level chip work where the right stencil match matters. A dependable addition to any GSM workshop handling Qualcomm-based motherboards.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46867955908769,"sku":"MST-SOLDERING-ACCESSORIES-1033","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-11-Qualcomm-Stencil-1.webp?v=1786470769","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-11-qualcomm-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}