{"product_id":"ycs-12-qualcomm-bga-reballing-stencil","title":"YCS 12 Qualcomm BGA Reballing Stencil – Snapdragon 7s Gen3, 7 Gen3, 6 Gen1, 4 Gen2","description":"\u003cp\u003eThe YCS 12 Qualcomm BGA Reballing Stencil gives you a precision 0.12mm steel mesh template for reballing Snapdragon 7s Gen3, 7 Gen3, 6 Gen1, and 4 Gen2 chipsets, covering SM7635, SM7550, SM6450, and SM4450 CPUs. Lay it directly over the BGA pads after chip removal and cleaning, and it holds every ball position steady while you place solder balls for reflow. You avoid bridging, missing balls, and uneven joints that cause dead-after-flash boards or repeated boot loop issues. It slots straight into your existing IC reballing workflow, whether you're running a hot air station or a BGA rework machine. Repair shops handling newer Qualcomm-powered Android boards need this stencil as a core part of their CPU repair toolkit.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46885131911329,"sku":"MST-SOLDERING-ACCESSORIES-1038","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-12-Qualcomm-Stencil.webp?v=1786738857","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-12-qualcomm-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}