{"product_id":"ycs-13-qualcomm-snapdragon-bga-reballing-stencil","title":"YCS 13 Qualcomm Snapdragon BGA Reballing Stencil","description":"\u003cp class=\"MsoNormal\"\u003e\u003cspan lang=\"en-PK\"\u003eThe YCS 13 Qualcomm Snapdragon BGA Reballing Stencil belongs to YCS's Repairman \"Comprehensive Network\" series, built for technicians who do CPU-level board repair on Snapdragon-powered Android phones. You align the stencil over the board, drop solder balls through the mesh, and reflow for a clean, even reball with no bridging. It's a bench-standard tool for dead-after-flash boards, CPU reballing after an IC change, and general Qualcomm chip rework. Like the rest of the YCS numbered series, the exact chipset markings are etched directly on the stencil itself, so you match it to your board before you commit to the job.\u003c\/span\u003e\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46884817436833,"sku":"MST-SOLDERING-ACCESSORIES-1037","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-13-Qualcomm-Stencil-1.webp?v=1786732920","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-13-qualcomm-snapdragon-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}