{"product_id":"ycs-hard-disk-bga-reballing-stencil-emmc-nand","title":"YCS Character Library Hard Disk BGA Reballing Stencil - EMMC\/EMCP\/NAND Chip Reballing Tool","description":"\u003cp\u003eYCS Character Library\/Hard Disk BGA Reballing Stencil is a precision steel mesh tool built for EMMC, EMCP, and NAND hard disk chip reballing on mobile phone motherboards. It covers 12 ball patterns — 60, 70, 110, 153, 162, 169, 178, 200, 221, 254, 297, and 315 balls — so one stencil handles most Android hard disk IC footprints technicians see on the bench. Model YDZZH9140107067 is designed for GSM repair shops doing dead-after-flash recovery, hard disk IC change, and BGA reballing work where accurate solder ball placement decides whether the chip survives.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46686552457377,"sku":"MST-SOLDERING-ACCESSORIES-1010","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-NANDEMMC-Stencil-1.webp?v=1783981203","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-hard-disk-bga-reballing-stencil-emmc-nand","provider":"KB GSM Store","version":"1.0","type":"link"}