{"product_id":"ycs-unisoc-01-bga-reballing-stencil","title":"YCS UNISOC-01 BGA Reballing Stencil – For UMS9230H, UMS512T, UIS8910 Chipsets","description":"\u003cp\u003eThe YCS UNISOC-01 stencil gives you a dedicated solder ball template built for UNISOC chipset reballing work on your repair bench. You place it directly over the UNISOC CPU or power IC pad after chip removal, spread solder paste evenly through the holes, and reflow with hot air to rebuild clean, uniform balls before remounting. Technicians handling dead phone and hang on logo cases on UNISOC-based Android boards use this stencil to avoid cold joints and bridging during CPU reballing. It fits directly into your existing PCB repair and IC change karna workflow without needing extra fixtures.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":46867961643169,"sku":"MST-SOLDERING-ACCESSORIES-1035","price":600.0,"currency_code":"PKR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8137\/6417\/files\/YCS-UNISOC-01-Stencil-1.webp?v=1786471562","url":"https:\/\/www.kbgsmstore.com\/products\/ycs-unisoc-01-bga-reballing-stencil","provider":"KB GSM Store","version":"1.0","type":"link"}