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25W0 Audio iC

25W0 Audio iC

Regular price Rs.250.00 PKR
Regular price Sale price Rs.250.00 PKR
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The 25W0 Audio IC is a replacement audio chip used on mobile phone motherboards to restore sound function on boards facing dead audio, no mic, or speaker faults. Technicians reach for this IC when a phone shows signs of audio issue after liquid damage, board short, or a failed reflow attempt. It sits in the audio signal path, handling how sound moves between the mic, earpiece, and speaker circuits. On your repair bench, this chip becomes useful once you've already ruled out a physical speaker or mic fault and traced the problem back to the IC itself. Ideal for GSM repair shops, board-level technicians, and service centers doing chip-level work.

⚖️ Weight: 0.01 kg

SKU:MST-IC-350

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Description

When a phone comes in with no sound, no mic response, or a dead speaker after liquid exposure, the audio IC is one of the first suspects on the board. The 25W0 Audio IC replaces a faulty or burnt chip in that exact audio path, giving technicians a direct fix instead of hunting for a jumper workaround that may not hold.You get a chip built for board-level repair work, not a plug-and-play accessory. That means installation calls for a hot air station, flux, and a steady hand at reballing — this isn't a job for technicians still building their microsoldering confidence. Before you commit to changing the IC, check the board for corrosion around the chip, test continuity on the audio lines, and confirm the fault isn't a broken trace instead. Swapping a good IC won't fix a cracked pad, and that mistake costs both time and stock.On your repair bench, this chip becomes relevant after diagnosis, not before it. A dead phone with no sound, a board stuck on hang-on-logo after a failed flash, or a unit showing charging issue alongside audio problems can sometimes point back to a damaged audio IC if the fault traces to that specific zone. Pattern unlock and FRP lock jobs won't involve this chip at all — it's strictly a hardware fault fix, not a software one.IC change karna at this level means prepping the pads carefully, avoiding excess heat that lifts nearby components, and reballing with the correct ball size for a clean reflow. Rushing the removal is where most board damage happens — not during installation, but while lifting the old chip off a board that's already stressed from a previous repair attempt.This IC fits into the broader board repair workflow: diagnostics first, then IC removal, pad cleaning, reballing, and finally reflow testing. Skipping any one of those steps is usually why a "new IC" install still doesn't restore sound. Pair it with a decent microscope for pad inspection and a reliable hot air station for consistent temperature control — the outcome depends more on your process than on the chip itself.For shops handling a steady volume of audio-fault boards, keeping a few of these in stock alongside your other repair ICs (WCD-series or SIA-series codecs, depending on what boards you commonly service) saves turnaround time. Since exact source and manufacturer batch data isn't independently verifiable for this listing, treat it as a functional replacement part and verify continuity and function on a test board before committing it to a customer's device.

Key Features

Replacement chip for board-level audio circuit repair

Suited for dead audio, no mic, or no speaker faults

Requires hot air reballing for installation

Used after diagnosis confirms an IC-level fault

Fits into standard PCB repair and rework workflow

Compatible with standard reballing and microsoldering tools

Useful for GSM technicians handling liquid-damage boards

Stockable part for repair shops handling chip-level jobs

Specifications

Product Entity Audio IC
Technology Entity Audio signal processing chip
Repair Process Entity Board-level IC reballing and rework
Industry Entity Mobile repair / GSM technician industry

Compatible Devices

Universal — not device-specific. Confirm against the original chip marking on the customer's board before purchase or installation, since audio IC compatibility is board-model dependent.

Common Repair Uses

Dead audio / no sound repair, no mic response fault, speaker not working after liquid damage, board-level audio circuit repair, reballing and chip-level rework on boards diagnosed with audio IC failure.

FAQ

What is the product name?
The product name is the 25W0 Audio IC.
What is this product used for?
This IC is used to repair dead audio, no mic, or no speaker faults on mobile phone motherboards at the chip level.
Which devices are compatible with this product?
Compatibility depends on the original board's chip marking — confirm the exact IC marking on the faulty board before ordering, since this isn't verified as device-specific.
Who should use this product?
This product suits mobile repair technicians, GSM service centers, and repair shops doing board-level microsoldering work.
Can this IC be installed with a regular soldering iron?
No — installation requires a hot air rework station and proper reballing, since the chip uses a BGA-style pad layout typical of mobile audio ICs.
Should I replace the IC before checking the board traces?
No — check continuity on the audio lines and inspect for corrosion first, since a broken trace or lifted pad is a common cause mistaken for IC failure.

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