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Brand: 2UUL

2UUL BH08 THE ONE JIG (Arabic Version)

2UUL BH08 THE ONE JIG (Arabic Version)

Regular price Rs.5,000.00 PKR
Regular price Sale price Rs.5,000.00 PKR
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The 2UUL BH08 THE ONE JIG (Arabic Version) gives you a rotary, no-rebound clamp that locks any mobile phone motherboard firmly on your repair bench. The anti-skid pad stops the board from shifting while you run hot air or reball a chip, and the built-in heat sink at the base lets heat escape faster during rework. You get three clamping heights — high, middle, low — so you adjust for thick or thin boards without fighting the jig. The IC-type fixture support holds the IC beam safely, so you remove back glue without cracking the chip. Built for daily use on dead phone, boot loop, and hardware fault repairs.

SKU:MST-SOLDERING-TOOLS-633

⚖️ Weight: 0.5 kg

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Description


When you're working a dead phone case on the bench, half the battle is keeping the motherboard still while you run hot air, pull an IC, or reball a chip, and the 2UUL BH08 THE ONE JIG (Arabic Version) solves exactly that problem with a rotary fixed clamping design that locks the board firmly and never rebounds mid-job. You place the motherboard in the jaws, rotate the shaft, and it grips the board tightly enough that your hands stay free for the actual repair work — no holding the board with one hand while you solder with the other. The clamp head carries a special anti-skid pad, so the board doesn't creep or slip once you start applying heat, which matters when you're chasing a tight reflow window on a Qualcomm or MediaTek chipset. Underneath the clamp, a heat sink pulls heat away from the fixture itself, letting hot air discharge more efficiently instead of building up around the jig — you feel this directly when you're running longer reflow cycles on IC change karna jobs. The rotary shaft doesn't just hold the board; it locks the motherboard or the IC itself more efficiently than a basic spring clamp, giving you a fixed, no-rebound grip whether you're stabilizing the board for a jumper lagana repair or anchoring it for microscope work. One of the more practical features on the 2UUL BH08 THE ONE JIG (Arabic Version) is its IC-type fixture support for back glue removal — the clamp is built to bear the force on the IC beam, holding up the empty sections of the IC so you don't crack it while peeling off black glue, which is exactly the kind of failure that ruins an otherwise good IC removal job. You also get height flexibility built into the base: loosen the two screws at the bottom, slide the fixing plate to the gear position that matches your board thickness or IC height, then tighten the screws back down to lock it in place at high, middle, or low level. This matters because motherboards vary a lot in thickness and component height across brands, and a fixed-height clamp forces you to compromise on grip strength. The jig also protects both layers of a double-layer motherboard during maintenance, spreading clamping pressure so you don't warp or stress the board while you work on it, and its jaws are shaped to accept phone and tablet motherboards of different sizes without needing a separate fixture for every device. The clamping head itself carries heat-resistant insulation, keeping heat away from sensitive components nearby while you focus hot air or a soldering iron on the target area. This is the Arabic-labelled version of the 2UUL "The One" Jig, built for technicians working in Arabic-speaking markets but functionally identical to the standard version in terms of clamping performance and build. On the bench, this tool sits at the diagnostics and PCB repair stage of your workflow — after you've identified a hardware fault, network issue, or charging issue, and you need the board locked down before you start IC replacement, reballing, or CPU repair. It pairs naturally with your hot air station, soldering station, microscope, and reballing kit, filling the gap between "board out of the phone" and "board under the microscope" that a lot of repair shops underestimate until they lose a chip to a slipped clamp.

Key Features

  • Rotary fixed clamping design, no rebound, fixed firmly for stable motherboard holding
  • Anti-skid pad on the clamp head prevents the motherboard from shifting mid-repair
  • Heat sink at the base of the clamp lets hot air discharge more efficiently during rework
  • Heat-resistant insulated clamping head protects nearby sensitive components from heat
  • IC-type fixture support holds the IC beam securely, preventing chip cracking during back glue removal
  • Adjustable high, middle, and low clamping height via the bottom fixing plate
  • Dual-layer protection shields both sides of double-layer motherboards during maintenance
  • Universal fit for mobile phone and tablet motherboards of different sizes and shapes

Specifications

Brand Entity 2UUL
Product Entity THE ONE JIG BH08 (Arabic Version)
Technology Entity Rotary clamping mechanism, heat-resistant insulated head
Compatible Device Entities Universal mobile phone and tablet motherboards
Repair Process Entity IC removal, back glue removal, reballing, PCB rework
Industry Entity Mobile repair tools, GSM technician equipment

Compatible Devices

Universal — not device-specific; designed for general mobile phone motherboard clamping across brands

Suitable for smartphone and tablet mainboards of various sizes and shapes

Works with both single-layer and double-layer motherboard designs

Common Repair Uses

Motherboard/PCB stabilization during hot air rework and reballing

IC removal and back glue removal without damaging the IC beam

CPU and chipset reflow support during dead phone or hardware fault repair

Board fixing during microscope-based soldering and jumper work

Secure clamping for connector-level and component-level board repair

FAQ

What is the product name?
The product name is 2UUL BH08 THE ONE JIG (Arabic Version).
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is BH08.
What is this product used for?
This product is used for clamping and holding mobile phone motherboards steady during IC repair, back glue removal, reballing, and general PCB rework.
Which devices are compatible with this product?
This product is compatible with mobile phone and tablet motherboards of various sizes and shapes on a universal, non-device-specific basis.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the 2UUL BH08 hold the motherboard at different height levels for different IC sizes?
Yes, the jig offers high, middle, and low clamping positions, adjusted by loosening the two bottom screws and repositioning the fixing plate before locking it back down.
Does this jig protect the IC from cracking during back glue removal?
Yes, the clamp is designed to bear the force on the IC beam, holding up the empty sections of the IC so it doesn't crack while removing black glue.

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