2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad

When you're reballing a CPU or NAND flash chip on a dead phone board, the smallest shift in your stencil ruins the whole job. The 2UUL BH15 MagGrid Pad solves this problem at the bench level. It's a magnetic silicone soldering pad built specifically for BGA, CPU, and IC chip repair, giving your stencil a stable base that doesn't move once you start planting tin.The pad is made from soft, high-temperature silicone rubber that handles heat up to 500°C without warping or losing shape. You can run your hot air station or reflow tool directly over it during reballing without worrying about the pad degrading underneath your chip. The strong magnetic adsorption is the real workhorse here — it locks your BGA stencil or steel mesh onto the pad so it doesn't shift or lift while you're planting tin, which means your ball grid lands where it's supposed to, every time.On the back of the pad, you'll find hollow heat-dissipation holes built into the design. This isn't just for cooling — it stops the steel mesh from bulging during the tin planting process, a common issue technicians run into with cheaper flat pads. The curved shape of the BH15 also means you get a seamless, hands-free fit against your chip during soldering, so you're not holding the stencil in place with one hand while working with the other.For chip-level work, the pad accommodates chip slot sizes of 0.3mm, 0.4mm, 0.5mm, and 0.8mm, covering the range you'll typically deal with on mobile phone CPU and NAND flash packages. Whether you're doing a CPU reball after a "dead after flash" situation, replacing a NAND IC on a board with boot loop issue, or working through a hard disk chip repair, this pad gives you the stable working surface reballing demands.At 104mm x 80mm x 8mm and 65.5g net weight, it's compact enough to sit permanently on your workstation without taking up bench space, and light enough to carry between jobs if you do on-site repair work. The silicone surface also wipes clean easily — flux residue and solder balls don't stick to it the way they do on bare metal or plastic surfaces, so you're not fighting cleanup between jobs.This pad fits naturally into your ISP and UFS repair workflow too. If you're already running eMMC programmers or UFS adapters on dead boards, having a dedicated reballing pad next to your hot air station rounds out a proper chip-level repair setup — instead of improvising with tape or bare heat mats that don't hold a stencil steady.For any shop doing regular board-level work — IC change, chip reballing, or NAND data recovery — the BH15 removes one of the most common points of failure in the process: stencil movement. It's a small accessory, but it directly affects how consistent your reballing results are, job after job.