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2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

Regular price Rs.15,000.00 PKR
Regular price Sale price Rs.15,000.00 PKR
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2uul BH17 CPU REBALL BASE Magnetic Dual-Sided BGA Reballing Platform Set for iPhone / Android

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Description

2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

2uul BH17 CPU REBALL BASE Magnetic Dual-Sided BGA Reballing Platform Set for iPhone / Android

2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set Best Price in Pakistan

Description

2UUL BH17 CPU REBALL BASE Magnetic Dual-sided Reballing Platform with A10-A19 Pro Exynos, Qualcomm, MTK, Hisilicon, EMMC RAM Stencil for iPhone 7-17 Pro Max and Android Phone repair. Double-sided solder balls, two thicknesses, with built-in strong magnets, allow for quick and precise CPU installation, ensuring no displacement during soldering. Suitable for repairing various mobile phone CPUs.

Feature:

  1. Double-sided solder ball design: Supports two different solder balls sizes simultaneously, suitable for repairing CPUs in both Apple and Android devices.
    2. Two thickness options: Offers two solder ball thicknesses: T0.6 (for Apple devices) and T0.35 (for Android devices), meeting the soldering requirements of different CPU models.
    3. Strong magnets: Built-in strong magnets ensure stable CPU fixation and prevent displacement during soldering.
    4. Precision Soldering: Provides a precise soldering platform, ensuring even distribution of solder balls and perfect CPU alignment.
    5. Wide Applicability: Particularly suitable for multiple mainstream mobile phone CPU models such as the SM8750 Snapdragon 8 Ultra, A19 Pro, and A19.
    6. Compact and Convenient: Compact design, suitable for use by repair personnel in limited spaces, easy to carry and store.

CPU stencil models (75pcs): 

1. For iPhone 7-17 Pro Max (12pcs):– A19 Pro– A19– A18 Pro– A18– A17– A16– A15– A14– A13– A12– A11– A102. Qualcomm series (17pcs): – SM8750– SM8450– SM8150– SM7325– SM7125– SM8650– SM8350– SM7550– SM7250– SM8550– SM7150– SM7450– SM8475/SM7475– SM8250-102– SM7350– SM8250-002– SM7225-00AB3. Hi Silicon series (9pcs):– Hi36C0– Hi36A0– Hi3690-5G– Hi3690-4G– Hi3680– Hi6280– Hi6290/L– Hi3640– Hi36704. Exynos series (11pcs): – Exynos 2200– Exynos 2100– Exynos 9820– Exynos 980– Exynos 8895– Exynos 1480-E8845– Exynos 1330-E8535P– Exynos 990– Exynos 1380-E8835P– Exynos 1280-E8825– Exynos 9815/10805. MTK series (14pcs): – MT6989W– MT6985W– MT6895Z– MT6897Z– MT6855V– MT6877V– MT6853V– MT8781/MT6789V– MT6983Z– MT6761V/6762V/6765– MT6885Z– MT6833V– MT6873V/6875V– MT6891Z/6893Z6. EMMC+RAM series (12pcs):– BGA 254– BGA 186– BGA 169– BGA 162– BGA 134– BGA 556– BGA 436– BGA 376– BGA 178– BGA 496– BGA 153

– BGA 221

Product Parameters:

 

Package includes:

  • 1 x Magnetic Base
  • 75 x Stencil

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