2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

Reballing a CPU on a dead phone board starts with holding the chip perfectly still, and the 2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set solves that problem before you pick up a squeegee. You get a compact 58 x 58 x 11 mm platform with built-in strong magnets, two working sides, and 75 stencils, so a single set covers most CPU and memory reballing jobs that land on your repair bench. You seat the chip, lay the stencil over it, and the magnets pull the chip and stencil into alignment and lock both in place. Nothing shifts while you spread paste or drop balls, which cuts down the bridging, missing balls, and skewed rows that force you to strip a chip and start again. The two sides carry different thicknesses. The T0.6 side suits Apple CPUs and the T0.35 side suits Android CPUs, so you flip the base instead of hunting for another fixture when an iPhone job follows a Qualcomm job. That matters on a busy day when a dead after flash board, a hang on logo phone, and a boot loop issue handset all wait for chip-level work. The stencil library gives you twelve iPhone CPU stencils from A10 through A19 Pro, seventeen Qualcomm stencils from SM7125 up to SM8750, nine HiSilicon stencils, eleven Exynos stencils, fourteen MediaTek stencils, and twelve eMMC plus RAM stencils covering BGA 134, 153, 162, 169, 178, 186, 221, 254, 376, 436, 496, and 556 footprints. That spread lets you reball Snapdragon boards, Samsung Exynos boards, MediaTek boards, and memory chips without buying a separate fixture for each chip family. The body uses CNC-machined aluminum alloy that withstands the heat of hot air rework, and the small footprint fits on a crowded bench beside your microscope. The BH17 sits in the middle of a full CPU repair workflow. You lift the chip with a preheater and one of your Hot Air Stations, clean the pads and the chip surface with flux and one of your Soldering Stations, and inspect the result under a Microscope. Then you reball on this platform, reflow the chip onto the board, and check for shorts with a Multimeter before you power the phone on. A PCB Holder keeps the board steady during the lift and the reflow, so pair this platform with a solid holder. When a phone dies after a failed flash and the memory chip needs reballing, the eMMC plus RAM stencils let you reball that chip and then bring the phone back with your eMMC Programmers, ISP Pinout Tools, or Test Boxes. If your bench also handles UFS phones, browse UFS Adapters for the programming side. Shops that already own basic Reballing Kits can treat the BH17 as the upgrade path from loose stencils toward a fixed, magnetic, repeatable setup. For repair shops and service centers in Lahore, Karachi, Islamabad, and beyond, the BH17 gives your technicians a consistent way to reball CPU chips in-house instead of sending boards out. The same magnetic lock, the same stencil fit, and the same two thickness options on every job make results predictable, and predictable results save chips and time. Technical institutes also gain from it, because students practice ball placement on a fixture that keeps the chip stationary. The set weighs 238 g net, so you can carry it between benches, and the package measures 64.5 x 64.5 x 34.5 mm, so it slides into a tool drawer. If you work at chip level on iPhone and Android boards every week, this platform belongs on your bench.