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Brand: 2UUL

2UUL BL01 MicroFix Hook Blades 4pcs/Set

2UUL BL01 MicroFix Hook Blades 4pcs/Set

Regular price Rs.1,200.00 PKR
Regular price Sale price Rs.1,200.00 PKR
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The 2UUL BL01 MicroFix Hook Blades give you four hardened steel hook blades built for precise underfill glue removal on mobile phone motherboards. Each blade carries a different hook angle, so you get the right edge for tight corners, IC pads, and CPU zones without dragging across traces. Technicians use this set before IC change, CPU removal, or board cleaning, where a clean scrape decides whether the pad survives. Compact, reusable, and built for daily bench work, this set belongs in every serious repair workshop's blade rack.

SKU:MST-SOLDERING-ACCESSORIES-887

⚖️ Weight: 0.09 kg

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Description

OverviewThe 2UUL BL01 MicroFix Hook Blades 4pcs/Set solves a problem every GSM technician runs into on the bench: getting old underfill glue off a motherboard without lifting a pad or scratching a nearby component. Phone manufacturers glue ICs, CPUs, and NAND chips directly onto the board to survive drops and vibration, and that same glue turns into a nightmare the moment you need to remove or reball that chip. 2UUL built this set specifically for that job, giving your hands four different hook profiles instead of forcing you to fight one flat blade through every angle on the board.Design and BuildEach blade in the BL01 set is made from iron that's hardened and hand-finished at the edge, not stamped and shipped raw. That hand-sharpening matters on a repair bench because a dull hook slips, and a slipping blade near a BGA pad means a scratched trace or a dead board. The four hooks differ in curve and angle, so one handles straight-line glue lines, another digs into corners near the IC edge, and the rest cover the tight spots around CPU and PMIC pads where a standard spudger can't reach. The compact 16 x 16 x 6 cm packaging keeps the set organized on a crowded workbench instead of loose blades rolling into your solder paste.Where It Fits in Your Repair WorkflowYou reach for this set before an IC change, not during flashing or software work. Once you've diagnosed a hardware fault on the motherboard, whether it's a dead phone after a bad reflow or a chip you suspect is causing a boot loop issue, the BL01 hooks let you break the underfill bond cleanly. That clean break protects the pad footprint underneath, which directly affects whether your reball attempt succeeds or you end up chasing lifted traces. Board cleaning before hot air rework, glue scraping around NAND before a chip-off read, and general PCB prep all run through this same blade set.Why Technicians Choose This Over a Single BladeA single flat blade forces you to change your grip and angle constantly, and every angle change is a chance to slip. Having four dedicated hooks means you pick the right tool for the exact spot on the board instead of forcing one edge to do a job it wasn't shaped for. The blades stay sharp through repeated use, so you're not replacing them every week, and their small footprint means they travel well in a technician's toolbox between service centers.Practical Value on the BenchThis isn't a novelty tool — it's the kind of accessory that quietly prevents costly mistakes. A lifted CPU pad or a scratched trace from a rough scraping job can turn a simple IC change into a full board write-off. The BL01 set exists to stop that outcome, giving you controlled, repeatable results whether you're pulling a CPU, prepping for reballing, or just cleaning old adhesive residue off a board you're about to diagnose further.

Key Features

Four hook blades with different angles in one set

Hardened iron construction for repeated daily use

Hand-finished cutting edges for controlled, clean scraping

Designed to break underfill bonds without lifting board traces

Compact profile reaches tight spots around IC and CPU pads

Reusable blades — no per-job disposal cost

Supports safer CPU and IC removal by loosening adhesive first

Lightweight design reduces hand fatigue during long bench sessions

Specifications

Brand Entity 2UUL
Product Entity MicroFix Hook Blades (BL01)
Technology Entity Hardened Iron Blade Manufacturing
Compatible Device Entities Qualcomm, MediaTek, Apple, Samsung chipset boards
Repair Process Entity PCB Underfill Glue Removal, IC/CPU Reballing Prep
Industry Entity Mobile Repair Tools, PCB Repair Equipment

Compatible Devices

Universal — not device-specific. Works across smartphone, tablet, and laptop motherboards regardless of chipset brand, since the tool interacts with physical adhesive rather than any electronic interface. Usable on boards carrying Qualcomm, MediaTek, Apple, Samsung, and other chipset families.

Common Repair Uses

PCB underfill glue removal, IC and CPU removal prep, motherboard cleaning before reballing, chip-off glue scraping ahead of NAND read/write work, general board-level prep for BGA rework.

FAQ

What is the product name?
The product name is 2UUL BL01 MicroFix Hook Blades 4pcs/Set.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is BL01.
What is this product used for?
This product is used for removing underfill glue from mobile phone motherboards during IC and CPU repair work.
Which devices are compatible with this product?
This product is compatible with all mobile phone and tablet motherboards, regardless of chipset brand, since it works on physical adhesive rather than device electronics.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB repair users.
Can these hook blades remove underfill glue without damaging the board?
Yes, the hand-finished hook edges are designed to break the glue bond along the pad edge without dragging across nearby traces when used at a shallow angle.
What material are the BL01 hook blades made of, and are they safe for CPU removal prep?
The blades are made from hardened iron, giving enough edge strength for repeated glue-scraping work around CPU and IC pads without deforming.