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Brand: 2UUL

2UUL BS148 Black Skull Solder Paste 148℃ 50g

2UUL BS148 Black Skull Solder Paste 148℃ 50g

Regular price Rs.1,600.00 PKR
Regular price Sale price Rs.1,600.00 PKR
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2UUL BS148 Black Skull Solder Paste is a 148°C low-temperature solder paste built for BGA, CPU, and IC reballing work on dense multilayer boards. Its low reflow point keeps heat exposure short during rework, so nearby components and pads stay safe from thermal stress. The 50g jar gives you enough paste for repeated reballing, jumper work, and short-pin soldering on iPhone, Samsung, and other tightly packed motherboards. Technicians use it where board temperature control matters most — layered boards, CPU reballing, and delicate IC removal jobs where standard high-temp paste risks lifting pads or damaging surrounding ICs.

SKU:MST-SOLDERING-ACCESSORIES-770

⚖️ Weight: 0.05 kg

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Description

When you're reballing a CPU or working a jumper on a board that's already been through two or three previous repairs, the melting point of your paste decides whether the job goes clean or the board fights you back. The 2UUL BS148 Black Skull Solder Paste is built around a 148°C melting point, which puts it in the low-temperature bracket technicians reach for when a board can't take another high-heat cycle. On multilayer boards where pads have already been reflowed once, running standard 217°C-plus paste raises the risk of lifted pads, delaminated layers, or dead ICs sitting next to your work area. Dropping to 148°C shortens the time your hot air station or iron needs to stay on the board, which means less heat soak into the layers underneath your target chip. This is the paste you reach for on iPhone and Samsung logic boards where the CPU, NAND, or power IC sits close to other components you can't afford to disturb. The 50g jar size fits comfortably on a repair bench and gives you enough working paste for dozens of reballing jobs, jumper repairs, and short-pin fixes before you need a refill, which keeps per-repair cost predictable for a shop running multiple boards a day. In actual bench use, this kind of low-temp paste gets used for CPU reballing after a board comes in dead after flash or stuck on a boot loop, where the fix is a reflow rather than a full chip swap. It also shows up in jumper work — running a fine wire between two points on a board where a trace has lifted or corroded — since the lower reflow temperature means the jumper wire and surrounding pads settle without extra stress on the joint. Screen and charging port technicians occasionally pull it out too, when a repair calls for touching a nearby IC pad without risking the display driver or charging IC sitting a few millimeters away. What separates a paste like this from generic solder wire is control: paste lets you place a precise amount exactly where you need it, under a microscope if the pitch is tight, rather than dragging solder across a board and cleaning up bridges afterward. Combined with a low melting point, that control matters most on boards where one careless reflow turns a simple repair into a dead board. For a shop that handles reballing, jumper work, and board-level repair as a regular part of the workload, keeping a jar of 148°C paste on the bench alongside your higher-temp paste gives you the option to match paste temperature to the specific repair instead of using one paste for every job. That flexibility is often the difference between a board that comes back working and one that needs a donor board search afterward.

Key Features

148°C low-temperature reflow reduces heat stress on multilayer boards

Suited for CPU and BGA reballing on repeat-repair boards

Works well for fine jumper soldering on lifted or corroded traces

Precise paste application under microscope for tight-pitch work

50g jar sized for repeated bench use across multiple repairs

Lower reflow point protects components sitting near the repair area

Fits into standard hot air rework and reflow workflows

Suitable for iPhone, Samsung, and other dense-layout smartphone boards

Specifications

Brand Entity 2UUL
Product Entity Solder Paste
Technology Entity Low-Temperature Reflow Soldering
Compatible Device Entities Smartphone Motherboards (iPhone, Samsung)
Repair Process Entity BGA/CPU Reballing, Jumper Repair
Industry Entity Mobile Phone Repair, PCB Rework

Compatible Devices

Universal — not device-specific; suited to multilayer smartphone motherboards (iPhone, Samsung, and similar dense-layout boards) where low-temperature reflow is needed

Common Repair Uses

CPU and BGA reballing, jumper wire soldering, short-pin repair, IC removal and reattachment near sensitive components, board-level rework on previously repaired boards

FAQ

What is the product name?
The product name is 2UUL BS148 Black Skull Solder Paste 148°C 50g.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is BS148.
What is this product used for?
This product is used for low-temperature reflow soldering, including CPU/BGA reballing, jumper repair, and board-level rework.
Which devices are compatible with this product?
This product is compatible on a universal basis with multilayer smartphone motherboards such as iPhone and Samsung boards where low-temperature reflow is needed.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does BS148 solder paste work for CPU reballing on iPhone boards?
Yes, its 148°C reflow point makes it a common choice for CPU and BGA reballing on iPhone and similar dense-layout boards where reduced heat exposure matters.
Why use 148°C paste instead of standard high-temperature solder paste?
Lower reflow temperature reduces the risk of lifted pads, delaminated layers, and damage to nearby ICs on boards that have already been through prior repairs.