Underfill glue and IC-bonded chips are two of the most common headaches on a repair bench, and the wrong tool turns a clean chip removal into a damaged pad or lifted trace. The 2UUL DA22 Hand Finish QUICK Blades Set solves that by giving you five dedicated blade profiles, each shaped for a specific step in board-level rework instead of forcing one blade to do every job.Every blade in the set comes with an integrated handle, so you don't waste time swapping a loose blade into a separate holder before you start. You pick up the blade you need and go straight to work. The handles resist heat up to 300°C, which matters because most underfill and IC removal jobs happen right after you've used a hot air gun on the board. A handle that softens or warps at that temperature is a liability near a heated CPU or NAND chip — these hold their shape.The blades themselves are made from polished high-carbon steel, hand-ground rather than machine-stamped, which gives them a finer, more consistent edge. That matters when you're separating a CPU from its pads or scraping black underfill glue off a motherboard — a rougher edge tends to skip or dig in, and on a modern tightly-packed board that's how you end up with a lifted pad or a shorted trace. The steel also has enough spring in it to flex slightly during prying without deforming permanently, so the blade keeps its shape through repeated use.Five blade types are included, and each one is built around a real repair step: separating CPU and NAND flash components that share a board, removing IC/CPU adhesive cleanly, tiering a CPU off in stages when it's tightly bonded, cutting side glue along chip edges, and scraping out underfill black glue from underneath a chip. That range covers the full underfill-to-removal workflow you'd normally need three or four different tools for.In day-to-day workshop use, this set earns its place on jobs like removing a dead CPU for reballing, clearing underfill before installing a replacement IC, cleaning glue residue before a board goes into ultrasonic cleaning, and separating stacked NAND/eMMC packages during eMMC repair work. If you're dealing with a board that's dead after flash, hang on logo, or has a hardware fault traced to a specific IC, this is the set you reach for before you touch a soldering iron again.Because the blades are compact and lightweight, they're easy to control under a microscope, which is where most of this work actually happens. You're not fighting a bulky handle while trying to keep your other hand steady on the board. The lightweight build also means less hand fatigue during longer rework sessions, which adds up when you're doing IC change or jumper lagana work back-to-back through the day.This isn't a tool tied to one phone brand or one chipset — it works on any smartphone or tablet motherboard where you need to clean underfill, separate a chip, or scrape glue, whether that's a Qualcomm, MediaTek, Samsung Exynos, or Apple-based board. For a repair shop or service center handling mixed brands daily, that universal usability is what makes a blade set worth keeping in the main toolbox rather than a drawer.