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2UUL FS158 JOINT X Solder Paste for Repair 158℃ 50g

2UUL FS158 JOINT X Solder Paste for Repair 158℃ 50g

Rs.1,500.00 PKR
Rs.1,500.00 PKR
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2UUL FS158 JOINT X Solder Paste is designed for precise mobile phone motherboard and BGA repair work.
Its low melting point formula helps reduce heat damage while ensuring stable soldering performance for IC, CPU, and SMD applications.

MST-SOLDERING-ACCESSORIES-960

⚖️ Weight: 0.08 kg

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Description

The 2UUL FS158 JOINT X Solder Paste 158℃ 50g is a professional-grade soldering solution designed for mobile phone motherboard repair and precision electronic work. Built for technicians handling delicate IC, CPU, BGA, and SMD repairs, this solder paste provides stable performance with a low melting temperature that helps minimize heat stress on sensitive components.

Its 158℃ low-temperature formula makes it suitable for advanced repair environments where excessive heat can damage nearby circuits or components. This allows technicians to work more safely and efficiently during mobile phone PCB repairs, chip rework, and micro soldering applications.

The smooth consistency of the solder paste helps ensure even application during repair work. It supports cleaner solder joints and reliable conductivity, making it useful for smartphone repair shops, electronics technicians, and professional rework stations. Whether you are repairing mobile ICs, CPU chips, or performing BGA reballing tasks, this solder paste is designed to improve soldering precision and workflow efficiency.

The 50g container offers practical daily use for repair professionals who regularly work on mobile devices and electronic boards. Its formulation is intended to provide stable adhesion and consistent soldering performance across different repair applications.

2UUL is widely recognized in the mobile repair industry for producing repair tools and consumables focused on precision electronics work. The FS158 JOINT X solder paste is developed for users who require controlled solder flow, dependable bonding, and better handling during intricate motherboard repairs.

This solder paste is suitable for various electronic repair scenarios including smartphone motherboard repair, BGA chip rework, CPU IC soldering, SMD component installation, and general electronics maintenance. For repair technicians seeking a lower temperature soldering option with professional usability, the 2UUL FS158 offers a practical and reliable solution.

Key Features

  • Low temperature 158℃ solder paste formula
  • Suitable for IC, CPU, BGA, and SMD repair work
  • Designed for mobile phone motherboard repairs
  • Helps reduce excessive heat exposure to components
  • Smooth application for precision soldering
  • Reliable solder joint performance
  • Suitable for professional repair technicians
  • 50g packaging for regular workshop use

Specifications

Name 2UUL FS158 JOINT X Solder Paste
Brand 2UUL
Material Solder Paste Compound
Color Gray
Melting Point 158℃
Application Mobile Phone Repair, BGA, SMD, IC, CPU Repair
Weight 50g
Packaging Type Jar Container

FAQ

Q1: What is the melting temperature of 2UUL FS158 solder paste?
The 2UUL FS158 JOINT X solder paste has a low melting point of 158℃ for controlled repair work.
Q2: Is this solder paste suitable for mobile phone repair?
Yes, it is specifically designed for mobile phone motherboard, IC, CPU, BGA, and SMD repair applications.
Q3: Can this solder paste be used for BGA rework?
Yes, the FS158 solder paste is suitable for BGA chip soldering and rework tasks.
Q4: Why is low temperature solder paste useful?
Low temperature solder paste helps reduce the risk of heat damage to sensitive electronic components during repair work.
Q5: What is the package size of this solder paste?
This product comes in a 50g container suitable for professional repair usage.
Q6: Is this product suitable for professional technicians?
Yes, it is commonly used by mobile repair technicians and electronics repair professionals.
Q7: Can it be used for SMD soldering applications?
Yes, it supports precision SMD soldering and electronic component repair work.