2UUL PB01 PadBall Solder Balls

When a pad lifts off an iPhone logic board — whether it happened during IC removal, a hot air mishap, or normal wear from repeated rework — soldering directly onto a bare or damaged pad rarely holds. You need fresh, uniform solder material sized correctly for that pad, and that's exactly what the 2UUL PB01 PadBall set gives you.PB01 is the iPhone-specific variant in 2UUL's PadBall lineup, built around a Sn63/Pb37 tin-lead alloy. This composition sits right at the eutectic point, melting cleanly around 183°C without passing through a mushy phase. On the bench, that translates into faster, more predictable reflow — you heat the pad, the ball melts and wets in one smooth motion, and you're not fighting partial-melt balls that crack or form cold joints later.The set covers five ball diameters: 0.2mm, 0.3mm, 0.45mm, 0.6mm, and 0.76mm. That range matches the pad pitch you'll actually encounter across iPhone CPU, NAND, PMIC, and small IC packages, so you're not stuck improvising with an oversized ball that bridges neighboring pads or an undersized one that leaves a weak joint. Pick the size that matches the original pad footprint, place it under the microscope, and reflow — no guesswork on volume.Each bottle ships 100,000 balls at a net weight of 5.5g, packed in a sealed, anti-static container measuring 16mm x 16mm x 32mm inside outer packing of 131mm x 105mm x 48mm. That's a serious working supply for a shop doing board repair daily — you won't be rationing balls on a multi-pad job, and a single bottle covers a large volume of iPhone-specific rework before you need a refill.In actual repair workflow, PB01 sits right after board diagnosis and IC removal, and right before reballing or direct chip reattachment. If a technician traces a dead phone or "hang on logo" fault to a lifted or oxidized pad, the fix isn't reflashing software — it's physically rebuilding that pad first. Apply flux, place the correctly sized ball, reflow under controlled heat, then move on to reballing the IC or reattaching the component. Skipping proper pad rebuild and just piling extra solder on a damaged pad is exactly how bridging and short-to-ground faults creep back in after the phone leaves your bench.Because the alloy is a standard leaded Sn63/Pb37 mix rather than a lead-free blend, wetting behavior stays consistent and predictable — useful when you're working fast under time pressure with a shop full of pending jobs. The balls hold their shape in storage and don't clump, so scooping out the right quantity under the scope stays clean.This isn't a tool you reach for occasionally — it's a consumable that belongs in every serious mobile repair workshop doing iPhone board-level work: IC change, pad rebuild after "IC change karna" jobs, reballing after "jumper lagana" fixes fail, or restoring a board a client already tried elsewhere. Keep PB01 stocked next to your reballing stencils and hot air station, and pad damage stops being a reason to reject a repair.