2UUL PB02 PadBall Solder Balls

When a pad lifts off an Android board or an IC comes off dirty, you need solder balls that reflow predictably under the microscope, not balls that scatter or bridge the moment your hot air hits them. The 2UUL PB02 PadBall Solder Balls solve that problem with a Sn63/Pb37 eutectic alloy, the same composition technicians trust because it melts at a fixed 183°C instead of a wide plastic range. That single-point melting means less guesswork on your station temperature and a cleaner reflow across the whole pad array.Each bottle holds 100,000 balls, sized at 0.2mm, 0.3mm, 0.45mm, 0.6mm, and 0.76mm. That spread matters on real boards — small CSP pads on RAM or PMIC chips need the 0.2mm to 0.3mm range, while GPU and CPU packages usually call for 0.45mm and above. You are not stuck buying separate bottles for separate ball sizes; PB02 hands you the full working range in one container, sized specifically for Android chipsets rather than the tighter iPhone pad geometry PB01 targets.Purity matters as much as size. Low-oxidation solder balls reduce the black residue that builds up during reflow, and that residue is exactly what causes shorts and cold joints on a rebuilt pad. With PB02, you get fewer stray balls rolling off the pad and a cleaner joint on the first pass, which cuts down rework and saves flux.On the bench, this is what PB02 actually gets used for. After you lift a dead chip to check for a hardware fault, the pads underneath often come up bare or damaged. Before you can reball and reattach the IC, you rebuild each pad with a properly sized ball, reflow it under hot air or an IR station, then flatten the array with a stencil or freehand under the microscope. Same story with charging issues traced back to a PMIC, or a board stuck on hang on logo after a botched IC swap — you are back to bare pads, and PB02 rebuilds them before you go any further.Packaging keeps things practical for a repair shop. The bottle measures 16mm x 16mm x 32mm and ships in a 131mm x 105mm x 48mm box, small enough to sit in a drawer next to your flux and stencils without eating bench space. At 7.2g net weight for 100,000 balls, a single bottle covers a heavy caseload of reballing jobs before you need a refill, which keeps your per-repair material cost low even on high-volume days.PB02 fits into the standard mobile repair chain: diagnose the fault, remove the damaged IC, clean and inspect the pads under the microscope, rebuild any missing or damaged pads with PadBall, apply flux, reball the chip on a stencil, then reflow and reattach. Skip a clean pad rebuild and you risk a chip that never makes proper contact — the phone comes back dead after flash, or you get an intermittent hang on logo that is nearly impossible to trace later. Getting the pad right the first time with correctly sized, low-oxidation balls is what separates a permanent repair from a comeback job.RoHS and REACH compliance means the alloy meets standard environmental and safety benchmarks, so you are not introducing contamination risk into sensitive board work. For any shop doing regular Android board-level repair — GPU reflow, PMIC reballing, general pad restoration — PB02 is a consumable you will restock often, not a one-off purchase.