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Brand: 2UUL

2UUL RS138 Red Skull Solder Paste for Repair 138℃ 50g

2UUL RS138 Red Skull Solder Paste for Repair 138℃ 50g

Regular price Rs.1,200.00 PKR
Regular price Sale price Rs.1,200.00 PKR
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The 2UUL RS138 Red Skull Solder Paste gives you a 138°C low-temperature formula built for delicate BGA reballing and motherboard repair work. You get smooth, even flow across pads without overheating nearby components, which matters most on multi-layer boards where one overheated IC can wreck the whole job. Technicians handling dead phone boards, IC change work, or jumper repairs get a paste that solders bright and full, with minimal cold joints or bridging. At 50g per syringe, it covers plenty of repair jobs on your bench before running out, and the low melting point protects sensitive chipsets during reflow.

SKU:MST-SOLDERING-ACCESSORIES-768

⚖️ Weight: 0.1 kg

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Description

Working on a motherboard where every extra degree of heat risks lifting a pad or cooking a nearby IC calls for a paste that melts fast and clean. The 2UUL RS138 Red Skull Solder Paste solders at 138°C, well below standard leaded pastes, so you get proper wetting on BGA balls and fine-pitch components without pushing heat into parts that can't take it.This paste sits in the RS (Red Skull) line from 2UUL, a brand already known on the repair bench for jigs, board holders, and soldering consumables. The RS138 variant is the lowest-temperature option in that lineup, positioned specifically for boards where standard 183°C or 199°C pastes carry too much thermal risk — think stacked ICs, power management chips, and small SMD components sitting close together on a crowded PCB.In real workshop use, this paste comes into play during IC reattachment after a chip lift, during CPU or NAND reballing, and when tinning pads before placing a new component. Because the melting point sits so low, you can rework the same spot two or three times without the pad lifting off the board — something that happens often with hotter pastes when a technician has to redo a joint. For dead-after-flash boards, hang-on-logo repairs, or a board that came in with a hardware fault after a bad repair attempt elsewhere, a low-temp paste like this gives you more room to fix mistakes without creating new ones.The paste itself flows evenly under a hot air gun or soldering iron, spreading across the pad instead of clumping, which cuts down on cold joints and bridging between neighboring pins. A clean, even spread also means less cleanup afterward — no scraping off excess solder that's ball up unevenly across the pad. Technicians running back-to-back jobs on a busy repair bench notice the difference in how consistently each application behaves compared to generic or unbranded pastes.Because 138°C solder paste is a specialized tool, it's not meant to replace your everyday 183°C paste for general soldering. It earns its place on the bench specifically for heat-sensitive repairs: power ICs, PMIC chips, and components mounted near other parts that already show heat damage or discoloration from a previous repair attempt. Keeping both a standard and a low-temperature paste on hand covers the full range of board-level work that comes through a typical Pakistani repair shop — from routine charging port and display flex work up to full motherboard rework.Storage matters with any paste-flux formula. Keeping the syringe capped tightly and stored at room temperature away from direct heat preserves the flux activity and prevents the paste from drying out before you've used the full 50g. A dried-out or oxidized paste won't flow properly no matter how precise your soldering technique is, so treating it as a consumable with a shelf life — not something to leave open on the bench — gets the most out of every syringe.For a service center running dozens of board repairs a week, having a dedicated low-temperature paste on hand turns what would otherwise be a risky reflow into a controlled, repeatable process. It's a small addition to the toolkit that directly reduces board damage during motherboard-level repair work.

Key Features

138°C low-temperature formula reduces heat stress on sensitive ICs

Smooth, even flow across BGA pads and fine-pitch pins

Cuts down on cold joints and solder bridging

Suitable for repeated rework on the same pad without lifting it

50g syringe dispenser for controlled, precise application

Works well under both hot air stations and soldering irons

Ideal for power IC, PMIC, and stacked-chip repair work

Part of 2UUL's established Red Skull soldering consumable line

Specifications

Brand Entity 2UUL
Product Entity RS138 Red Skull Solder Paste
Technology Entity Low-temperature solder paste (138°C)
Compatible Device Entities Android motherboards, iPhone motherboards, general PCB assemblies
Repair Process Entity BGA reballing, IC reattachment, PCB soldering
Industry Entity Mobile repair, PCB rework, GSM technician tools

Compatible Devices

Universal — not device-specific. Suitable for motherboard-level repair across Android and iPhone chipset families, and any PCB requiring low-temperature BGA or SMD rework.

Common Repair Uses

BGA reballing, IC reattachment after chip lift, PCB pad tinning before component placement, power IC and PMIC rework, jumper wire soldering, and general motherboard-level repair on heat-sensitive boards.

FAQ

What is the product name?
The product name is 2UUL RS138 Red Skull Solder Paste 50g.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is RS138, part of the Red Skull series.
What is this product used for?
This product is used for low-temperature BGA reballing, IC reattachment, and general motherboard-level soldering repair.
Which devices are compatible with this product?
This product works across Android and iPhone motherboard repair since it's a universal solder paste, not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB rework users.
Can this paste be used for repeated rework on the same pad?
Yes, since it melts at a low 138°C, technicians can rework the same joint multiple times with reduced risk of the pad lifting off the board.
Is RS138 suitable for power IC and PMIC repair?
Yes, RS138 is specifically positioned for heat-sensitive components like power ICs and PMICs where standard 183°C or 199°C paste carries too much thermal risk.