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2UUL SC14 Daily Solder Flux 10cc

2UUL SC14 Daily Solder Flux 10cc

Regular price Rs.500.00 PKR
Regular price Sale price Rs.500.00 PKR
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The 2UUL SC14 Daily Solder Flux is a 10cc no-clean gel flux built for everyday mobile phone motherboard repair. It removes oxides and surface impurities before soldering, giving you a cleaner joint and stronger solder adhesion on the first attempt. The gel consistency stays exactly where you place it instead of spreading across the board, which matters when you're working close to small SMD components or BGA pads. It cures quickly, resists heat without softening, and leaves a protective layer over the repaired area. Formulated from naturally derived organic acids, it's a practical daily-use flux for technicians who solder ICs, connectors, and fine pitch components on repair benches every day.

SKU:MST-SOLDERING-ACCESSORIES-495

⚖️ Weight: 0.08 kg

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Description

Every technician who has fought a cold joint or a component that keeps lifting off the pad knows how much of the outcome depends on flux quality, and the 2UUL SC14 Daily Solder Flux 10cc is built to remove that variable from your daily repair work. This is a no-clean gel flux, meaning it does not run or pool the way liquid fluxes do, so when you're working on a crowded mobile motherboard with ICs, capacitors, and connectors packed tightly together, the flux stays exactly where you apply it instead of bridging onto neighboring components. That control matters most during BGA and CSP reballing and reflow work, where a stray film of flux under an adjacent chip can cause a short or a hidden dry joint that only shows up after the phone is reassembled. The formula is made from naturally derived organic acids rather than harsh rosin-based chemicals, which gives it strong cleaning action against oxidation on copper pads and solder balls while keeping the residue mild enough that most boards don't require an aggressive post-repair clean. You apply a small amount to the pad or the joint, place your component, and the flux activates under heat to strip the oxide layer so solder flows and bonds properly instead of sitting on top of a contaminated surface. Once the joint cools, the flux cures rapidly and does not leave a soft or sticky residue behind, so you're not chasing dead ends where a joint looks soldered but never fully bonded because the flux never fully cured. That rapid, clean cure is what keeps repeat rework off your bench: a joint fluxed with SC14 sets fast enough that you can move to the next pad without waiting on the board or worrying that reheating nearby components will disturb an already-soldered connection. Beyond soldering, this flux also functions as a light protective coating. After a repair, technicians commonly use it to insulate exposed pads, protect components from oxidation and moisture exposure, and touch up sections of the PCB where the solder mask layer has peeled or chipped away from prior rework, since the cured film adds a thin barrier over the exposed copper. It is also used to fix and secure enameled wire jumpers on boards where a trace has lifted or broken, holding the wire in place while adding a layer of insulation around the connection point. The flux is resistant to high temperatures during use, so it holds its properties through hot air rework and repeated reflow cycles without breaking down or softening, which is important on multi-step board repairs where the same area gets reheated more than once. At 10cc, the bottle is sized for daily bench use rather than one-off jobs, so it works well as a stocked consumable in a repair shop that handles a steady volume of motherboard work, charging port repairs, and IC-level jobs. For technicians handling dead phones, boot loop boards, or units with a charging or hardware fault traced to a specific IC or connector, having a flux that cures fast and cleans reliably shortens the time spent on each repair and reduces the chance of a comeback caused by an incomplete solder joint. It suits both hobbyist repair work and professional service center use, and its no-clean nature makes it a practical default flux to keep at every soldering station on the bench rather than switching formulas between routine and precision jobs.

Key Features

  • No-clean gel formula stays in place instead of spreading across the board
  • Made from naturally derived organic acids for stronger, cleaner oxide removal
  • Cures rapidly with no dead ends, reducing rework on the same joint
  • Resistant to high temperatures during hot air rework and repeated reflow
  • Insulates and protects components after soldering is complete
  • Touches up peeling or damaged solder mask sections on PCBs
  • Secures and insulates enameled wire jumpers on repaired boards
  • 10cc size suited for daily, high-volume bench use

Specifications

Brand Entity 2UUL
Product Entity SC14 Daily Solder Flux
Technology Entity No-clean gel flux, organic acid-based formula
Compatible Device Entities Universal — mobile phone PCB and motherboard repair
Repair Process Entity BGA/CSP soldering, IC soldering, PCB rework, enameled wire repair, solder mask touch-up
Industry Entity Mobile phone repair, PCB microsoldering, electronics rework

Compatible Devices


Universal — not device-specific; suitable for PCB and motherboard repair work across mobile phone brands and models.

Common Repair Uses


BGA and CSP chip soldering and reballing, IC-level motherboard repair, charging port and connector resoldering, solder mask layer touch-up, enameled wire jumper fixing, general PCB rework and component protection after soldering.

FAQ

What is the product name?
The product name is 2UUL SC14 Daily Solder Flux 10cc.
What is the brand of this product?
The brand of this product is 2UUL.
What is the model of this product?
The model of this product is SC14.
What is this product used for?
This product is used as a no-clean gel flux for soldering, reflow, and PCB rework on mobile phone motherboards.
Which devices are compatible with this product?
This product is universal and works across mobile phone brands and PCB types rather than being tied to a specific device.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Is this flux suitable for BGA and CSP soldering?
Yes, the gel consistency and organic acid formula make it suitable for BGA and CSP soldering and reballing work.
Does this flux need cleaning after soldering?
No, it is a no-clean formula, so it does not require a separate cleaning step after the joint cures.