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9896B Audio iC

9896B Audio iC

Regular price Rs.300.00 PKR
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The 9896B is a BGA-packaged audio IC used across several Samsung models, including the Galaxy A5 (A500F), Galaxy J330, Galaxy S9, S9+, and Galaxy Note 9. Technicians reach for this chip when a phone goes silent on both speakers, the mic stops picking up sound, or the earpiece and headphone jack all die together — a pattern that points to the audio codec rather than a software fault. Reflow or replace this IC on your bench with a hot air station and you restore audio without touching the rest of the board. Sold new, ready for direct BGA reballing and mounting.

⚖️ Weight: 0.01 kg

SKU:MST-IC-173

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Description

When a Samsung phone loses sound completely — no speaker, no mic, no earpiece, no headphone output all at once — the fault almost never sits in software. That symptom pattern is the classic fingerprint of a dead audio codec IC, and on the Galaxy A5, A5000, J330, S9, S9+, and Note 9, that codec is the 9896B.You'll see this failure walk into your workshop in a few common ways. A customer says their phone went quiet after an update or a drop, factory resets did nothing, and the service center quoted a full motherboard swap. On the Note 9 in particular, this exact failure pattern has been documented by technicians tracing complete audio loss — both speakers, both mics, and the headphone jack going out together — back to the 9896B sitting next to the MAX98512 audio amp. If your diagnostic points at the audio path and rules out a loose connector or damaged flex, the 9896B is where you go next.Diagnosing before you commit to a reflow saves you a wasted IC. Check the board for cracked solder joints or shift damage around the codec footprint first — sometimes a clean reflow with your hot air station fixes a dead audio issue without a full IC change. When the chip itself is faulty, whether from a liquid damage event, an ESD spike, or straight component failure, a fresh 9896B and a proper reball fix it for good.This is a BGA component, so it demands the same care any fine-pitch reflow job needs. Clean the pads thoroughly after removing the old chip, keep your hot air station at a controlled temperature to avoid lifting neighboring components, and use flux generously during reballing to get even solder distribution across the ball grid. Rushing this step is the single biggest reason technicians see a "fixed" phone come back with the same complaint a week later — a cold joint on one corner of the IC is enough to bring back intermittent audio.Keep in mind this chip is specifically tied to the Samsung boards listed above — it isn't a universal audio IC you can drop into any device, so confirm the board revision before you order. Stock a few of these alongside your MAX98512 units if you handle a steady flow of Samsung audio complaints; the two chips get blamed for the same symptom often enough that having both on the bench saves you a return trip to the customer.For a shop running steady Samsung repair volume, this is a low-cost, high-turnover part worth keeping on the shelf rather than ordering one at a time. Pair it with a reliable hot air rework station and a decent microscope for BGA alignment, and audio-dead complaints on these models become a same-day fix instead of a motherboard replacement quote.

Key Features

Direct replacement for the original 9896B audio codec on supported Samsung boards

BGA package suited for hot air reflow and reballing workflows

Addresses total audio loss — speaker, mic, earpiece, and headphone jack together

Confirmed compatibility across A5, A5000, J330, S9, S9+, and Note 9 boards

New condition, untested-on-board until installed

Common alternative to a full motherboard replacement for audio-dead units

Works alongside MAX98512 diagnostics on Note 9/S9 boards where both ICs share the fault pattern

Compact SMD footprint keeps board rework contained to the audio zone

Specifications

Brand Entity Samsung (device compatibility)
Product Entity 9896B Audio IC
Technology Entity Audio Codec IC, BGA Package
Compatible Device Entities Galaxy A5, Galaxy A5000, Galaxy J330, Galaxy S9, Galaxy S9+, Galaxy Note 9
Repair Process Entity BGA Reflow, IC Reballing, Audio Circuit Repair
Industry Entity Mobile Phone Repair, PCB Repair

Compatible Devices

Samsung Galaxy A5 (A500F), Samsung Galaxy A5000, Samsung Galaxy J330, Samsung Galaxy S9, Samsung Galaxy S9+, Samsung Galaxy Note 9

Common Repair Uses

Fixing complete audio loss (speaker, mic, earpiece, and headphone jack failing together), no-sound-after-drop or liquid damage repairs, BGA reflow and reballing of the audio codec, replacing a confirmed dead audio IC after ruling out flex or connector faults

FAQ

What is the product name?
The product name is the 9896B Audio IC.
Which devices is this IC compatible with?
It's compatible with the Samsung Galaxy A5 (A500F), A5000, J330, S9, S9+, and Note 9.
What is this product used for?
It's used to repair complete audio loss on supported Samsung boards — when speaker, mic, earpiece, and headphone jack all stop working together.
What package type is this IC?
It's a BGA/SMD package, meaning it needs hot air reflow and reballing rather than a simple pin swap.
Who should use this product?
Mobile repair technicians, GSM repair shops, and service centers handling Samsung audio-dead cases.
Is this IC the same as the MAX98512?
No — the 9896B is the audio codec, while the MAX98512 is a separate audio amplifier IC. On Note 9 and S9 boards, both are checked together since they share the same failure symptom.
Can a reflow fix the issue instead of replacing the IC?
Sometimes. If the fault comes from a cracked or shifted solder joint rather than a dead chip, a controlled hot air reflow on the existing 9896B can restore audio without a full replacement — worth checking before you commit to swapping the chip.

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