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Aifen F3 Hot Air Gun 1000W — Roc Curve Mode BGA Rework Station for Mobile Motherboard Repair

Aifen F3 Hot Air Gun 1000W — Roc Curve Mode BGA Rework Station for Mobile Motherboard Repair

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The Aifen F3 Hot Air Gun delivers 1000W of precision heating power built specifically for BGA chip desoldering, motherboard rework, and IC removal on mobile phone PCBs. Its Roc three-segment curve heating mode automates the preheating and desoldering sequence — you set the temperature and time per stage, and the machine handles the rest. With a 100°C–500°C range, color screen display, hand-replaceable 7B heating core, global voltage switching power supply, and six included nozzles, the F3 gives your repair bench professional-grade hot air performance in a compact, lightweight station.

SKU:MST-SOLDERING-ACCESSORIES-998

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Description

Hot air gun work on
mobile motherboards demands a tool that separates preheating from peak
desoldering temperature — and does it reliably every time. Rush a cold board
straight to 400°C and you risk PCB warping, pad lift, or nearby component
damage. The Aifen F3 solves this with its Roc three-segment curve heating mode:
a built-in workflow that guides the heating process through three distinct
temperature stages before the board reaches desoldering readiness.

Here's how Roc mode
works in practice. You configure three heating intervals — stage one and stage
two handle preheating at progressively higher temperatures, each for a set
duration you control. Stage three reaches your target desoldering temperature.
Once the F3 completes all three stages, the buzzer sounds — that's your signal
to start chip removal. The display shows current stage, real-time temperature,
air volume level, and countdown timer throughout the entire sequence. No
guessing when the board is ready, no watching a temperature dial hoping it
stabilizes. When the buzzer goes off, the board is at the correct temperature
for clean BGA chip removal.

This matters
enormously for IC change karna jobs on high-value motherboards — Samsung,
iPhone, Qualcomm Snapdragon-based boards, MediaTek chipset boards — where a
single misjudged desoldering temperature causes pad damage that turns a simple
hardware fault repair into an expensive rework job. The Roc curve mode takes
that risk out of the equation by standardizing your preheating workflow.

The F3 runs on a 1000W
switching power supply that supports global voltage input. Whether your
workshop operates on standard Pakistani 220V power or you're connecting through
a voltage regulator for sensitive work, the F3 handles it. Switching power supply
architecture also means the unit stays compact and light — no heavy transformer
adds bulk to your repair bench. Air volume adjusts from level 001 to 160,
giving you fine control from gentle PCB warm-up passes to full-force airflow
for larger component removal.

The heating core
system is one of the F3's standout design upgrades. The 7B rotary heating core
installs and removes by hand — turn to lock, turn to release, no screwdriver
needed. When your heating core wears out or you need to swap to an 11b
integrated core for different work, the changeover takes seconds rather than
interrupting your workflow with tools. One 7B core comes standard in the
package; the included 11b integrated core gives you a backup ready to go.

Six nozzles come
standard with the F3, including the 15×15mm and 15×17mm square nozzles
specifically sized for motherboard chip removal work. These square nozzles
focus heat precisely over BGA pads and surface-mounted ICs, preventing heat
spread to adjacent components. The TJ-218 dedicated bracket keeps the handle
positioned at the correct angle during work — essential for long desoldering
sessions where arm fatigue affects precision placement.

The line control
handle gives you dual operation modes: temperature control mode for direct
adjustment, and memory control mode where you recall saved settings for
repeated jobs. Pakistani repair shops running high volumes of the same model —
like Samsung A-series or iPhone 12/13 board rework — benefit from saving your
proven temperature and air volume profiles and recalling them instantly across
every unit that comes in.

The F3's temperature
range spans 100°C to 500°C, covering everything from gentle flex cable
reseating at low temperatures to full BGA chip desoldering at the upper range.
Display work, charging IC removal, dead after flash board inspection requiring
component swaps, network IC replacement — all of these jobs sit within the F3's
operating parameters. The color screen UI shows all active parameters
simultaneously: stage, temperature setpoint, real-time temperature, air volume,
and countdown — so you keep eyes on the work, not on hunting through menus.

The complete package —
host, 7B and 11b heating cores, six nozzles, TJ-218 bracket, connect wires,
power cord, and manual — arrives ready for immediate use on your repair bench.

Key Features

  • Roc three-segment curve heating mode
    automates board preheating through three timed temperature stages with
    buzzer alert at desoldering readiness — eliminates guesswork on BGA rework
    jobs
  • 1000W switching power supply with global
    voltage input — compact and light, no heavy transformer, compatible with
    standard Pakistani 220V workshop power
  • 100°C–500°C temperature range covers
    low-temperature flex reseating through high-temperature BGA chip
    desoldering and IC removal
  • Hand-replaceable 7B rotary heating core —
    twist to remove, twist to lock, no tools needed; 11b integrated core also
    included in package
  • Air volume adjusts from level 001 to 160 —
    fine control from gentle PCB warm-up to full-force airflow for large
    component removal
  • Color screen displays current stage,
    real-time temperature, air volume level, and countdown simultaneously
    during Roc curve operation
  • Dual handle control modes (temperature
    control and memory) — save and recall proven settings for high-volume
    same-model repair jobs
  • Includes 6 nozzles — 15×15mm and 15×17mm
    square nozzles for precise BGA pad targeting — plus TJ-218 dedicated
    bracket for correct-angle gun positioning

Specifications

Brand Entity Aifen (Foshan Cengon Electronic Intelligent Equipment Co., Ltd.)
Product Entity Aifen F3 Hot Air Gun, Aifen F3 BGA Rework Station, 1000W Hot Air Station
Technology Entity Roc three-segment curve heating mode, switching power supply, 7B rotary heating core, color screen UI, global voltage input, memory control mode
Compatible Device Entities Mobile phone motherboards, Samsung PCB, iPhone logic board, Qualcomm Snapdragon chipset boards, MediaTek chipset boards, BGA components, SMD ICs
Repair Process Entity BGA chip desoldering, IC removal, motherboard rework, PCB preheating, hot air soldering, component reflow, charging IC change, network IC replacement
Industry Entity Mobile phone repair, GSM hardware repair, PCB rework, BGA rework station, hot air gun repair tools Pakistan

FAQ

What is the product name?
The product name is Aifen F3 Hot Air Gun.
What is the brand of this product?
The brand is Aifen, manufactured by Foshan Cengon Electronic Intelligent Equipment Co., Ltd.
What is the model of this product?
The model is F3.
What is this product used for?
This product is used for BGA chip desoldering, IC removal, motherboard component rework, PCB preheating, and precision hot air soldering on mobile phone and electronic circuit boards.
Which devices are compatible with this product?
The Aifen F3 is compatible with mobile phone motherboards across all brands — including Samsung, iPhone, and Android boards using Qualcomm Snapdragon and MediaTek chipsets — wherever hot air desoldering or rework is required.
Who should use this product?
This product suits mobile repair technicians, GSM hardware engineers, BGA rework specialists, repair shop owners, and service centers performing board-level chip removal and soldering work.
What is the Roc curve mode on the Aifen F3, and how does it help with BGA chip desoldering on mobile motherboards?
Roc mode runs three sequential heating stages — the first two preheat the PCB at progressively higher temperatures for set time durations, and the third stage reaches your target desoldering temperature. When all three stages complete, the buzzer sounds as your desoldering cue. This prevents thermal shock to the board and eliminates the pad damage risk from rushing straight to peak temperature. Each stage's temperature and time is freely configurable, with a maximum of 330 seconds per stage.
Does the Aifen F3 support global voltage input, and what is the air volume range for fine-control rework?
Yes — the F3 uses a switching power supply that accepts global voltage input, making it compatible with Pakistani 220V workshop power without a separate regulator. Air volume adjusts from level 001 to 160, giving you low-airflow precision for delicate SMD work and high-airflow output for larger BGA chip removal.