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Amaoe GLE1 0.12mm BGA Reballing Stencil for Google Tensor CPU – Universal Series

Amaoe GLE1 0.12mm BGA Reballing Stencil for Google Tensor CPU – Universal Series

Regular price Rs.999.00 PKR
Regular price Sale price Rs.999.00 PKR
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The Amaoe GLE1 is a precision stainless steel stencil built for reballing the Google Tensor CPU used in Google Pixel devices. With a 0.12mm aperture, it delivers accurate tin ball placement for IC change karna work on Tensor chipsets. Built for repair shops and GSM technicians handling dead phone motherboards, CPU reballing, and hardware fault diagnosis, this stencil holds up under repeated hot air rework sessions. A reliable addition to any Tensor CPU repair workflow at your repair bench.

SKU:MST-SOLDERING-TOOLS-1373

⚖️ Weight: 0.05 kg

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Description

Reballing a Google Tensor CPU demands a stencil that lines up every ball position on the first try, and the Amaoe GLE1 is built exactly for that job. This is a universal series stencil designed specifically for Google Tensor processors, the chipsets found across the Pixel lineup that Pakistani technicians increasingly see coming in for dead after flash and hardware fault repairs.
The stencil uses a 0.12mm aperture, a size chosen for the ball pitch and pad density typical of modern Tensor packages. At this thickness, solder ball deposits come out even across the entire grid, so you avoid the bridging and thin spots that cause a reball to fail testing after reassembly. Stainless steel construction means the GLE1 handles direct heat from your hot air station without warping, so the same stencil keeps its shape through dozens of jobs rather than degrading after a handful of uses.
Working with this stencil follows the standard reballing sequence your bench already runs: strip the old solder from the CPU pads, clean the substrate thoroughly, seat the Tensor CPU into the stencil so the apertures sit flush over the ball pads, then apply solder balls or paste with a squeegee pass. Once the tin sits correctly in every hole, reflow under controlled heat and lift the stencil away cleanly. Because the aperture spacing matches the actual Tensor ball layout, technicians get fewer misaligned balls and less rework compared to using a generic universal stencil that only approximates the pitch.
This stencil earns its place in board-level repair work, not just casual IC swaps. When a Pixel motherboard comes in with a CPU that needs to come off for reballing due to boot loop issue symptoms, board short, or a failed IC change karna attempt elsewhere, the GLE1 gives you a repeatable path back to a working reball instead of guessing at ball placement freehand. It also fits into training environments, where instructors need a stencil that produces consistent results so students can actually see correct technique rather than compensate for a poor-quality tool.
Because it is a passive tool with no electronics inside, there is nothing to configure and nothing that wears out except the stencil mesh itself with heavy use. Store it flat, keep it free of old solder residue between jobs, and it stays accurate for a long service life on the bench. For a repair shop that regularly takes in Google Pixel devices, keeping a GLE1 on hand alongside your standard reballing kit means you are not stuck outsourcing Tensor CPU work or turning away jobs that need precise chip-level repair.
Pair it with your existing hot air rework station, flux, and solder balls, and the GLE1 slots directly into the reballing station and reballing kits category of tools your workshop already runs daily.

Key Features

• 0.12mm aperture matched to Google Tensor CPU ball pitch
• Stainless steel build resists warping under repeated hot air exposure
• Universal series design for Tensor CPU reballing across supported Pixel boards
• Even solder ball deposition reduces bridging and cold joints
• Reusable across multiple reballing jobs without losing shape
• Fits directly into standard hot air rework and reballing workflow
• Simple flat storage, no calibration or setup required
• Precise hole alignment reduces reball failure rate

Specifications

Brand Entity Amaoe
Product Entity GLE1 BGA Reballing Stencil
Technology Entity BGA Reballing, Stencil Printing
Compatible Device Entities Google Pixel, Google Tensor CPU
Repair Process Entity CPU Reballing, PCB Repair, Motherboard Repair
Industry Entity Mobile Repair, GSM Technician Tools

Compatible Devices

Google Tensor CPU family, used across Google Pixel series devices with Tensor processors

Common Repair Uses

CPU reballing after board short or dead after flash cases, IC removal and reattachment, solder ball placement following hot air rework, motherboard-level Tensor CPU repair and reflow

FAQ

What is the product name?
The product name is the Amaoe GLE1 0.12mm BGA Reballing Stencil for Google Tensor CPU.
What is the brand of this product?
The brand of this product is Amaoe.
What is the model of this product?
The model of this product is GLE1.
What is this product used for?
This product is used for reballing the Google Tensor CPU during motherboard-level repair work.
Which devices are compatible with this product?
This stencil is compatible with the Google Tensor CPU family used in Google Pixel devices.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users working on Pixel motherboards.
What aperture size does this stencil use for Tensor CPU reballing?
The stencil uses a 0.12mm aperture matched to the Tensor CPU ball pitch.
Can this stencil be reused across multiple reballing jobs?
Yes, its stainless steel construction withstands repeated hot air exposure so it stays usable across multiple reballing jobs without losing shape.