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Brand: AMAOE

Amaoe LCD3 iPhone 6S-17 Series Reballing Stencil – Precision LCD & Face ID IC BGA Reballing Template for Mobile Repair

Amaoe LCD3 iPhone 6S-17 Series Reballing Stencil – Precision LCD & Face ID IC BGA Reballing Template for Mobile Repair

Regular price Rs.999.00 PKR
Regular price Sale price Rs.999.00 PKR
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The Amaoe LCD3 iPhone 6S-17 Series Reballing Stencil gives you a precision-cut BGA template built for reballing the LCD display driver IC and Face ID dot projector IC across iPhone logic boards from the 6S generation through the 17 series. Laser-etched apertures match the exact BGA pad layout on each board, so you get clean, evenly sized solder balls without bridging or misalignment. Built from heat-resistant steel, the stencil holds its shape through repeated reflow cycles, giving repair shops a reusable tool instead of a one-time consumable. Whether you're fixing a dead-after-flash board, a display flicker, or a Face ID fault, this stencil keeps your reballing workflow fast and accurate.

SKU:MST-SOLDERING-ACCESSORIES-1091

⚖️ Weight: 0.01 kg

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Description

The Amaoe LCD3 iPhone 6S-17 Series Reballing Stencil puts a purpose-built BGA template on your bench for one of the most common board-level jobs you face in a mobile repair shop: reballing the LCD display driver IC and the Face ID dot projector IC after a display or Face ID fault. You already know the scenario — a customer brings in a dead phone, a white screen, a flickering display, or a Face ID fault after a drop or a bad flash, and the fix comes down to pulling the IC, cleaning the pads, and putting fresh solder balls down in exactly the right spot. This stencil covers that workflow across a wide generation span, from iPhone 6S boards through the newer 17 series, with laser-cut apertures matched to each board's BGA pad layout section by section, so you don't have to eyeball ball placement or guess at pitch on an unfamiliar board. Each section carries clear model markings, so on a busy repair day you flip straight to the right layout instead of hunting through a drawer of loose templates trying to match holes to pads by eye. The steel build resists warping when it sits on a hot air station or reflow plate, which matters more than most technicians realize — a stencil that bows even slightly after a few uses starts producing uneven balls, bridging, and rework you didn't plan for on your schedule. Because this one holds its shape through repeated thermal cycles, it stays accurate job after job instead of turning into a one-time consumable you replace every week or two. You get consistent ball height and spacing straight out of the pack, which cuts down on the retries that eat into your bench time when a stencil doesn't sit flat or the holes don't line up cleanly with the IC pads underneath. It works the way your bench already works — lay the stencil over the cleaned pad area, apply solder paste through the openings, lift it off carefully, and reflow with your existing hot air station or BGA rework machine. No extra fixtures, jigs, or proprietary hardware required, so it slots straight into a soldering and rework process you've already got dialed in for daily use. For shops running a high volume of display and Face ID repairs, having one stencil that spans this many iPhone generations means less inventory to stock and less time spent digging for the right template mid-repair when a customer is waiting on a same-day turnaround. It also fits naturally into a broader dead-after-flash or boot loop recovery workflow, since board-level IC faults on the LCD driver or Face ID side often show up alongside power and boot issues that only clear once the IC gets reflowed correctly and the pads make solid contact again. Technicians handling PCB repair at the component level — not just software-side fixes with a box or flashing tool — will find this stencil earns its place next to the hot air station, flux, solder paste, and tweezers as a standard part of the reballing kit on the bench. It's a straightforward tool with one specific job: get your solder balls placed accurately, every time, across a broad range of iPhone boards, without the guesswork that comes from working freehand or with a stencil that has already lost its precision after heavy use. If your shop handles display, touch, or Face ID repairs regularly across both older and newer iPhone models, this is the kind of tool that pays for itself quickly in reduced rework, fewer callbacks, and faster turnaround on jobs that would otherwise eat up hours of bench time better spent on the next repair in the queue.

Key Features

  • Laser-cut BGA apertures matched to LCD driver IC and Face ID IC pad layouts
  • Dedicated stencil sections covering multiple iPhone generations, 6S through 17 series
  • Heat-resistant steel construction that resists warping under repeated reflow cycles
  • Reusable design that holds micron-level accuracy across many reballing jobs
  • Reduces solder bridging and uneven ball height during reballing
  • Compact form factor fits standard BGA rework and hot air stations
  • Clear model-section markings for fast identification during multi-board repair days
  • Works alongside standard solder paste, flux, and hot air rework tools

Specifications

Brand Entity Amaoe
Product Entity LCD3 BGA Reballing Stencil
Technology Entity Laser-cut BGA/SMT stencil technology
Compatible Device Entities iPhone 6S–17 Series logic boards
Repair Process Entity LCD driver IC and Face ID dot IC reballing
Industry Entity Mobile phone repair / GSM technician industry

Compatible Devices

  • iPhone 6S / 6S Plus logic boards (LCD & Face ID IC section)
  • iPhone 7 through iPhone 14 series logic boards (LCD IC / Face ID dot IC BGA pads)
  • iPhone 15, 16, and 17 series logic boards (LCD driver IC / Face ID IC BGA pads, per stencil section markings)
  • Scoped to LCD driver IC and Face ID IC footprints — not a full-board or CPU-level stencil

Common Repair Uses

  • LCD display driver IC reballing after display flicker, white screen, or display-related faults
  • Face ID dot projector IC reballing after Face ID or TrueDepth module failures
  • BGA pad reflow and solder ball realignment on iPhone logic boards
  • Board-level repair preparation before reflow soldering on hot air or BGA rework stations

FAQ

What is the product name?
The product name is Amaoe LCD3 iPhone 6S-17 Series Reballing Stencil.
What is the brand of this product?
The brand of this product is Amaoe.
What is the model of this product?
The model is LCD3.
What is this product used for?
This product is used for reballing the LCD display driver IC and Face ID dot projector IC on iPhone logic boards.
Which devices are compatible with this product?
This stencil covers logic boards from iPhone 6S through the iPhone 17 series, sectioned by model for the LCD and Face ID IC footprints.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB repair users.
Does the Amaoe LCD3 stencil support both LCD IC and Face ID dot IC reballing?
Yes, the stencil includes dedicated sections for both the LCD driver IC and the Face ID dot projector IC.
Can this stencil be reused across multiple reballing jobs without losing hole precision?
Yes, the heat-resistant steel construction holds its shape through repeated reflow cycles, keeping aperture accuracy consistent job after job.