Amaoe Mi18 Stencil
Amaoe Mi18 Stencil
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Amaoe MI:18 JLQ JR510 CPU Universal Series BGA Reballing Stencil for POCO C40
The Amaoe Mi18 Stencil is a precision BGA reballing stencil built for the JLQ JR510 CPU used on the Xiaomi POCO C40 motherboard. Made from stainless steel, it holds its shape through repeated high-heat reflow cycles, so you get accurate ball placement job after job. Beyond the CPU, this stencil covers surrounding ICs on the same board — WCN3950, PMJ510, BGA153, SOSG761, BGA200, WCD9370, and WTR2S65 — letting you handle a full board-level repair with one tool instead of switching between multiple stencils on your bench.
SKU:MST-SOLDERING-TOOLS-363
⚖️ Weight: 0.15 kg
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Description
Amaoe MI:18 JLQ JR510 CPU Universal Series BGA Reballing Stencil for POCO C40
When a POCO C40 comes in dead after flash or with a hardware fault traced back to the CPU, you need a stencil that matches the JR510's ball pattern exactly, and that's exactly what the Amaoe Mi18 Stencil delivers. This is a single-CPU-series stencil, not a generic multi-device sheet, so the apertures line up precisely with the JLQ JR510 pads without you having to hunt for the right window on a shared plate. The stainless steel body resists warping even after you've run it through dozens of reflow cycles on the hot air station, which matters when you're doing IC change or CPU reballing back-to-back through a busy repair day. You lay the Amaoe Mi18 Stencil directly over the chip footprint on the board, tack it down so it doesn't shift, then apply your solder balls or paste through the apertures with a scraper — the tight aperture tolerance means the balls land where they're supposed to, not smeared across neighboring pads, which cuts down on bridging and the rework that comes with it. Since this stencil isn't limited to the CPU alone, it also covers the WCN3950 Wi-Fi/Bluetooth combo IC, the PMJ510 power management chip, and the BGA153, SOSG761, BGA200, WCD9370, and WTR2S65 packages found on the same POCO C40 board, so one purchase handles the CPU plus most of the surrounding IC-level jumper and reball jobs that come up on this device. That's a real time saver on the bench — instead of stopping mid-repair to dig out a different stencil for the power IC or the RF section, you keep working off the same sheet. In practical terms, this tool sits at the reballing stage of your workflow: after you've pulled the faulty chip with hot air, cleaned the pads on the board, and confirmed the CPU or IC itself is good (or replaced it), you bring in the Amaoe Mi18 Stencil to redeposit fresh solder balls before reflow and remounting. It pairs naturally with the rest of your BGA station setup — a hot air rework station for lift and reflow, a PCB holder to keep the board steady while you align the stencil, flux and solder paste for the actual deposit, and a microscope if you're working on fine-pitch packages like the WTR2S65 or BGA200 where eyeballing alignment alone isn't reliable. For technicians running a service center or repair shop that sees POCO C40 units regularly — whether the complaint is boot loop, hang on logo, dead after flash, or a straightforward CPU-related hardware fault — having this stencil on hand means you're not waiting on a supplier order mid-job. It's a lightweight, low-cost addition to your toolkit, but it's the difference between a clean, first-time-right reball and a board you have to touch twice because the ball pattern didn't match. Whether you're training on reballing technique or you're an experienced GSM technician doing it daily, the precision of the aperture cut is what separates a stencil that saves you time from one that costs you a second attempt.
Key Features
- Aperture pattern cut specifically for the JLQ JR510 CPU footprint
- Stainless steel construction that withstands repeated reflow heat without warping
- Covers additional POCO C40 board ICs: WCN3950, PMJ510, BGA153, SOSG761, BGA200, WCD9370, WTR2S65
- Thin 0.12mm profile for accurate, controlled solder ball deposit
- Lightweight at 0.02kg for easy handling and storage on the bench
- Reusable across multiple reballing jobs without losing shape
- Works with standard solder paste and solder ball reballing technique
- Single-item package, ready to use out of the box
Specifications
| Brand | AMAOE |
| Model | MI-18 |
| Category | BGA Reballing Stencil |
| Compatibility | JLQ JR510 CPU |
| Supported Devices | Xiaomi POCO C40 |
| Material | Stainless steel |
| Thickness | 0.12mm |
| Weight | 0.02kg |
| Package Contents | 1 x Stencil |
Compatible Devices
- Xiaomi POCO C40
- Boards built on the JLQ JR510 CPU platform
Common Repair Uses
- CPU reballing for the JLQ JR510 on POCO C40 motherboards
- Reballing the WCN3950 Wi-Fi/Bluetooth combo IC
- Reballing the PMJ510 power management IC
- Reballing RF and transceiver-related packages (BGA153, SOSG761, BGA200, WCD9370, WTR2S65)
- Solder paste application before component remounting
- Board-level dead phone and hardware fault repair on POCO C40