Amaoe SAM20 BGA IC Reballing Stencil – 0.12mm MT6835V CPU Stencil for Samsung Galaxy A15 5G (SM-A156U/A156E)

When a Samsung Galaxy A15 5G board comes into your workshop with a dead-after-flash fault, a boot loop issue, or a hardware fault traced back to the CPU IC, the Amaoe SAM20 BGA IC Reballing Stencil gets that board back to a stable solder joint. Amaoe calibrates this stencil to a precise 0.12mm thickness and engineers it specifically around the MediaTek Dimensity 6100+ platform, matching the exact ball-grid layout of the MT6835V CPU package that sits at the heart of the SM-A156U and SM-A156E board revisions. You place the stencil directly over the cleaned pads, apply solder paste or drop solder balls through the precision-cut apertures, then lift it away to leave a perfectly uniform ball pattern ready for reflow — no guesswork, no uneven balls, no bridging between pads. The square apertures form each ball with a consistent size and shape, which keeps your reflow profile predictable and cuts down the rework you'd otherwise do chasing cold joints or shorted pads. This stencil belongs to Amaoe's SAM series, the same numbered lineup GSM technicians already use across older Samsung flagship and mid-range boards, so if your bench already runs SAM12, SAM17, or SAM19 for other Galaxy models, the SAM20 slots into that same reballing workflow without a learning curve. Beyond the CPU package itself, the sheet also carries apertures matched to the board's companion ICs — including the MT6377W and MT6375P power management chips, the MT6631N connectivity IC, and the MT6319NP and MT6197W support chips — so a single stencil covers more than the main CPU reball when you tackle a full board-level repair. That matters on a bench where a dead phone complaint often traces back to more than one IC, and switching between multiple mismatched stencils wastes time and raises the risk of contaminating pads with the wrong ball size. The 0.12mm gauge also matters for repeat use: thinner stencils flex and warp faster under repeated heat exposure near your hot air nozzle, while this calibrated thickness holds its shape through dozens of reball cycles. In your actual workflow, this stencil sits between board cleaning and reflow: you remove the faulty CPU with hot air, clean the pads down to bare copper, flux the site, seat the SAM20 stencil using its alignment reference, apply your solder balls or paste, and reflow at your station's normal profile for the chipset. That gives you a CPU package with ball height and spacing that matches OEM specification, exactly what you need before you reattach an MT6835V die or prepare a replacement chip for the same board family. Samsung's A-series and Dimensity-based boards carry dense CPU packages, and working without a matched stencil usually produces inconsistent balls, tombstoning, or a chip that lifts on the next reflow cycle — problems this stencil eliminates at the source. For a repair shop or service center handling volume Galaxy A15 5G intake, keeping the SAM20 stencil on the bench alongside your existing SAM-series set lets every board-level CPU reball follow the same repeatable, verified process instead of relying on freehand ball placement. It's a small, reusable piece of equipment, but it directly affects your first-pass success rate on chip reballing jobs, where most of your labor time and IC cost gets spent. Pair it with your hot air station, a reballing fixture or PCB holder to keep the board steady, and a microscope for pad inspection before you commit to reflow, and the SAM20 becomes a straightforward extension of the ISP, UFS, and eMMC-level board repair work you already run on Samsung hardware in your shop. Store it flat in a static-safe sleeve between jobs, since a bent or creased mesh throws off aperture alignment on the next A15 5G board that lands on your bench.