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Amaoe Stencil SM8450

Amaoe Stencil SM8450

Regular price Rs.599.00 PKR
Regular price Sale price Rs.599.00 PKR
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The Amaoe SM8450 BGA Reballing Stencil is precision-engineered at 0.12mm thickness for accurate CPU and RAM chip reballing on Snapdragon 8 Gen 1 devices. Compatible with Xiaomi 12 Pro, iQOO 9 Pro, OnePlus GT2 Pro, Magic V, and other SM8450-based boards. Built from durable stainless steel mesh, it's a go-to tool for mobile PCB repair technicians across Pakistan.

SKU:MST-SOLDERING-TOOLS-239

⚖️ Weight: 0.01 kg

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Description

Mobile repair work demands tools that leave no room for error — and when it comes to SM8450 chip reballing, the Amaoe SM8450 BGA Reballing Stencil delivers exactly the precision technicians rely on.

Designed specifically for Qualcomm Snapdragon 8 Gen 1 (SM8450) chipsets, this stencil covers two critical reballing jobs: the SM8450 CPU and the SM8450 RAM. Whether you're working on a Xiaomi 12 Pro, an iQOO 9 Pro, a OnePlus GT2 Pro, or an Honor Magic V, you get consistent solder ball placement every time — no misalignment, no rework.

The 0.12mm aperture thickness is the sweet spot for fine-pitch BGA work. Tight enough to prevent solder bridging, open enough to allow clean paste flow. This isn't an afterthought measurement — it's what separates reliable board repairs from failed ones on high-density chipsets.

Amaoe is a respected name in the mobile repair industry across China and internationally. Their stencils are manufactured using laser-cut stainless steel, which holds its shape under repeated use and resists warping from heat exposure. If you've worked with generic steel mesh templates before, the difference in flatness and hole accuracy is immediately noticeable.

For repair shops handling Snapdragon 8 Gen 1 device volume — especially Xiaomi flagships and iQOO Pro series — this stencil is a practical investment. It reduces solder waste, speeds up the reballing process, and improves first-attempt success rates on IC chip repairs.

Comes as a single stencil unit. Compatible with standard BGA reballing stations. Suitable for professional repair benches and experienced technicians working on current-generation flagship Android boards.

Key Features

  • Precise 0.12mm aperture thickness for accurate solder ball deposition on SM8450 chipsets
  • Covers SM8450 CPU and RAM positions — two critical reballing points in a single tool
  • Laser-cut stainless steel mesh construction for flat, warp-resistant performance under repeated use
  • Compatible with Xiaomi 12 Pro, iQOO 9 Pro, OnePlus GT2 Pro, Honor Magic V and other SM8450-based devices
  • Designed by Amaoe, a professional-grade repair tooling brand trusted by mobile technicians
  • Reduces solder bridging risk due to calibrated aperture precision
  • Reusable and durable — built for workshop environments with high repair volume

Specifications

Name Amaoe SM8450 BGA Reballing Stencil
Brand Amaoe
Model SM8450
Material Stainless Steel (Steel Mesh)
Aperture Thickness 0.12mm
Chip Compatibility SM8450 CPU, SM8450 RAM
Supported Devices Xiaomi 12 Pro, iQOO 9 Pro, OnePlus GT2 Pro, Honor Magic V, Zhixi Network devices
Package Contents 1 x BGA Reballing Stencil
Application BGA Reballing / IC Chip Repair

FAQ

Q1: Which devices is this stencil compatible with?
It is designed for SM8450-based flagship phones including Xiaomi 12 Pro, iQOO 9 Pro, OnePlus GT2 Pro, and Honor Magic V. Any device running the Qualcomm Snapdragon 8 Gen 1 chipset that uses SM8450 CPU or RAM layout can benefit from this stencil.
Q2: Does this stencil cover both CPU and RAM reballing?
Yes. The Amaoe SM8450 stencil includes positions for both the SM8450 CPU chip and the SM8450 RAM chip, making it a complete solution for full chipset-level reballing on compatible boards.
Q3: What thickness is the aperture and why does it matter?
The aperture is 0.12mm thick. This measurement directly affects how much solder paste is deposited per ball position. At 0.12mm, the stencil achieves a balance between sufficient paste volume and protection against bridging — which is especially important on dense, fine-pitch BGA chips like the SM8450.
Q4: Is this stencil compatible with standard BGA reballing stations?
Yes. It is designed to work with standard professional BGA reballing fixtures and stations commonly used in mobile repair workshops. No proprietary equipment is required.
Q5: How many uses can I expect before the stencil degrades?
Amaoe stencils are made from laser-cut stainless steel, which is significantly more durable than thin foil alternatives. With proper cleaning after each use and flat storage, the stencil can reliably handle dozens of reballing sessions without dimensional distortion or aperture wear.

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