
Description
FAQ
Q1: Which devices is this stencil compatible with?
It is designed for SM8450-based flagship phones including Xiaomi 12 Pro, iQOO 9 Pro, OnePlus GT2 Pro, and Honor Magic V. Any device running the Qualcomm Snapdragon 8 Gen 1 chipset that uses SM8450 CPU or RAM layout can benefit from this stencil.
Q2: Does this stencil cover both CPU and RAM reballing?
Yes. The Amaoe SM8450 stencil includes positions for both the SM8450 CPU chip and the SM8450 RAM chip, making it a complete solution for full chipset-level reballing on compatible boards.
Q3: What thickness is the aperture and why does it matter?
The aperture is 0.12mm thick. This measurement directly affects how much solder paste is deposited per ball position. At 0.12mm, the stencil achieves a balance between sufficient paste volume and protection against bridging — which is especially important on dense, fine-pitch BGA chips like the SM8450.
Q4: Is this stencil compatible with standard BGA reballing stations?
Yes. It is designed to work with standard professional BGA reballing fixtures and stations commonly used in mobile repair workshops. No proprietary equipment is required.
Q5: How many uses can I expect before the stencil degrades?
Amaoe stencils are made from laser-cut stainless steel, which is significantly more durable than thin foil alternatives. With proper cleaning after each use and flat storage, the stencil can reliably handle dozens of reballing sessions without dimensional distortion or aperture wear.