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Amaoe U-GGE1 BGA Reballing Stencil for Google Tensor G2/G3/G4/G5 – Pixel Series CPU

Amaoe U-GGE1 BGA Reballing Stencil for Google Tensor G2/G3/G4/G5 – Pixel Series CPU

Regular price Rs.999.00 PKR
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Reball the Google Tensor CPU and RAM496 package on Pixel motherboards without hunting for separate stencils. The Amaoe U-GGE1 covers Tensor G2, G3, G4, and G5 package codes on a single 0.12mm laser-cut mesh, so you switch between Pixel generations on the same bench without swapping tools. Built for technicians who handle dead-after-flash, hang-on-logo, and hardware-fault jobs on Pixel boards regularly. Line up the pads, drop solder balls in one pass, lift, and reflow — no guesswork on ball pitch. A compact, single-purpose stencil that earns its spot in a Tensor-focused repair kit.

SKU:MST-SOLDERING-TOOLS-1372

⚖️ Weight: 0.05 kg

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Description

When a Pixel phone comes in dead after a drop or shows a hang-on-logo fault traced back to the SoC, you need a stencil that matches the exact ball pattern on the Tensor package — get it wrong and you're reflowing a chip that never makes contact. The Amaoe U-GGE1 solves this by covering multiple Tensor generations on one tool instead of forcing you to stock a separate stencil for every Pixel model that comes through your workshop.
This is a 0.12mm precision-cut mesh built specifically around the BGA package layouts for Tensor G2, Tensor G3, Tensor G4 (both the F1KZ1Y04 and P050510513 variants), Tensor G5, and the RAM496 memory package. If your bench sees Pixel 7-series through Pixel 10-series boards, this single stencil replaces what would otherwise be four or five model-specific templates cluttering your drawer.
The 0.12mm gauge is thin enough for direct heating on a hot air station without warping, so you place it flush over the CPU or RAM pads, apply solder balls with a scraper, and heat it in one pass. For a technician running a busy repair counter, that single-pass alignment matters — Tensor packages carry a dense ball count, and a stencil with the correct pitch is what separates a clean reball from a chip that lifts off during testing.
Where this stencil earns its place in a workshop is CPU-related dead phone cases: no power, network issue traced to the SoC, or a board that hangs on logo after a software marna attempt failed to bring it back. It's also the right call when RAM-related instability shows up — random reboots, apps crashing on a board that otherwise powers on fine, which often points to a cold joint on the RAM496 package rather than the CPU itself. In both cases, reballing rather than a straight IC change karna approach saves the original chip and avoids sourcing a hard-to-find replacement Tensor unit.
Because Google sources Tensor chips through different fabrication runs across generations, package footprints shift slightly between G2, G3, and G4 variants — this is exactly why Amaoe ships two separate G4 codes (F1KZ1Y04 and P050510513) rather than treating G4 as one uniform layout. The U-GGE1 accounts for that variation instead of forcing a single generic pattern across every Tensor board you see.
Handle it the way you would any fine-pitch stencil: store it flat, avoid folding or creasing the mesh, and clean off flux residue after each use so the holes don't clog with solder buildup. A stencil this precise loses accuracy fast if it's tossed loose in a toolbox with heavier equipment.
For a Pixel-focused repair shop or a service center that takes in a steady mix of Google phones alongside Samsung and Xiaomi work, this stencil is a low-cost addition that directly extends what your existing hot air rework station can already do — no new equipment, just the right template for the job in front of you.

Key Features

• Covers Tensor G2, G3, G4, and G5 package codes on one stencil
• 0.12mm precision laser-cut mesh for fine-pitch BGA work
• Includes both G4 variants (F1KZ1Y04 and P050510513)
• Covers RAM496 memory package alongside the CPU packages
• Direct-heat compatible with standard hot air rework stations
• Single-pass solder ball placement reduces reflow attempts
• Compact, lightweight design (0.02 kg) for easy bench storage
• Reduces the need for separate model-specific stencils per Pixel generation

Specifications

Brand Entity Amaoe
Product Entity BGA Reballing Stencil
Technology Entity Direct-heat solder ball planting stencil
Compatible Device Entities Google Pixel (Tensor G2–G5 series)
Repair Process Entity BGA reballing, CPU rework, RAM package rework
Industry Entity Mobile phone motherboard repair, GSM technician tools

Compatible Devices

Google Tensor G2, Tensor G3, Tensor G4 (F1KZ1Y04 and P050510513 package variants), and Tensor G5 chipset packages, plus the RAM496 memory package — covering the Tensor CPU generations used across Google Pixel phones from the 7-series through the 10-series.

Common Repair Uses

BGA reballing of the Tensor CPU and RAM496 package on Pixel motherboards, dead-after-flash and hang-on-logo repair, board-level diagnostics for network or power faults traced to the SoC, and RAM-related instability repair (random reboots, app crashes tied to a cold RAM joint).

FAQ

What is the product name?
The product name is the Amaoe U-GGE1 BGA Reballing Stencil.
What is the brand of this product?
The brand of this product is Amaoe.
What is the model of this product?
The model is U-GGE1.
What is this product used for?
It's used for reballing the Google Tensor CPU and RAM496 package on Pixel phone motherboards.
Which devices are compatible with this product?
It's built for Google Tensor G2, G3, G4, and G5 chipset packages, plus the RAM496 memory package, covering Pixel phones from the 7-series through the 10-series.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this one stencil really cover all four Tensor generations?
Yes — it's cut for the G2, G3, both G4 package variants, and G5 footprints, so one tool handles CPU reballing across those Pixel generations instead of four separate stencils.
Can this stencil be used for RAM496 reballing as well as the CPU?
Yes, the RAM496 package pattern is included alongside the Tensor CPU packages on this stencil.