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Forward FW-BF04 1300W Hot Air Rework Station – BGA SMD Desoldering Tool

Forward FW-BF04 1300W Hot Air Rework Station – BGA SMD Desoldering Tool

Regular price Rs.48,000.00 PKR
Regular price Sale price Rs.48,000.00 PKR
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The Forward FW-BF04 is a 1300W hot air rework station built for BGA and SMD repair work on your bench. A ceramic heating core paired with K-type thermocouple sensing and microcomputer PID control keeps temperature accuracy at ±2°C, so you get consistent results on chip reballing, IC removal, and board-level rework. Four memory channels let you save your preferred temperature and airflow settings for repeated jobs, and the magnetic handle switches to standby the moment you set it back on the stand. Built for technicians who run ISP, eMMC, and CPU-level repair daily, the FW-BF04 handles dead phone motherboard work without the temperature drift that damages sensitive

SKU:MST-REWORK-STATION-105

⚖️ Weight: 6.0 kg

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Description

Every technician who does board-level repair knows the difference a stable hot air station makes. Push too much heat into a dead phone motherboard and you crack the PCB or lift a nearby pad. Run too cold and the IC never releases cleanly. The Forward FW-BF04 solves this with a 1300W ceramic heating core matched to K-type thermocouple sensing, feeding real-time temperature data back into a microcomputer PID control loop. The result is ±2°C accuracy across the full 100°C–500°C range, which matters when you're pulling a CPU off a board that already has other components soldered close by.
Airflow control on the FW-BF04 goes from 5% to 200%, giving you a wide working window between delicate SMD components and larger BGA chips that need sustained heat. A double ball vortex fan spins at 15,000–18,000 RPM to move that air, and Forward built the housing around a brushless turbine design that keeps noise down during long repair sessions — something you'll appreciate when you're running the station for hours at a service center bench.
The handle itself does most of the daily work. Three buttons let you switch between four memory channels, adjust temperature, control air volume, and toggle air supply mode without reaching for the main unit every time you change jobs. If you're moving between a Qualcomm board needing one profile and a MediaTek board needing another, you set both channels once and switch with a button press. The handle also carries a magnetic switch: pull it off the bracket and the station goes into working mode automatically; place it back and it drops into standby with cooling airflow, which extends the life of the heating element and cuts power draw when you're not actively using it.
Safety is built into the core electronics. If airflow ever fails, the FW-BF04 cuts power to the heating core automatically rather than letting it sit and overheat — a fault mode that damages cheaper stations over time. The imported heating core is rated for a long service life under continuous workshop use, which lowers the replacement cost you'd otherwise face with lower-end hot air guns that burn out their elements within months.
For hardware fault diagnosis and repair, this station fits directly into your existing workflow. Reballing a CPU or NAND chip requires even heat distribution and a stable hold temperature — the PID control handles that without you babysitting the dial. Removing an IC for jumper lagana or board-level trace repair means you need heat concentrated enough to release solder but controlled enough that you don't warp the PCB layer underneath. The adjustable airflow and nozzle compatibility on the FW-BF04 give you that control on both small SMD components and larger shielded ICs.
The main unit measures 174x230x173mm and weighs 3.1kg, with the bracket adding another 1.2kg — solid enough to sit steady on a repair bench without shifting during use. Handle tube length runs 800mm, giving you working reach without the cable feeling short when you're positioned over a board on a PCB holder.
Where this station earns its place on a professional bench is repeatability. A repair shop running multiple technicians on rotating shifts needs a tool where channel 1 always means the same temperature and airflow every time, regardless of who used it last. The four memory channels solve that directly — no guessing, no re-calibrating between users. That consistency matters most on jobs like hang on logo repair after IC reflow, where inconsistent heat is often the reason a repair fails a second time.
The FW-BF04 sits well within a full rework setup. Pair it with a PCB holder to keep boards steady during extended heat application, a microscope for visual inspection of pad condition before and after reflow, and an ISP tool or eMMC programmer for the software side of the same repair job. Technicians handling boot loop issues that trace back to hardware — rather than a software marna fix — will find the temperature stability here reduces the retry rate on chip reflows compared to fixed-output heat guns.
Whether you're running a solo repair bench or managing a service center with several technicians, the Forward FW-BF04 gives you the temperature control, safety cutoffs, and repeatable channel memory that board-level and BGA rework demands.

Key Features

1300W ceramic heating core delivers fast, stable heat for BGA and SMD rework

K-type thermocouple sensing with microcomputer PID control holds ±2°C accuracy

Four programmable memory channels save temperature and airflow presets per job

Airflow adjustable from 5% to 200% for fine control across component sizes

Double ball vortex fan running 15,000–18,000 RPM for strong, low-noise airflow

Magnetic switch handle auto-enters standby cooling mode when placed on bracket

Automatic power cutoff on fan failure protects the heating core from overheating

Three-button handle control for on-the-fly channel, temperature, and airflow switching

Specifications

Brand Entity Forward
Product Entity FW-BF04 Hot Air Rework Station
Technology Entity PID Temperature Control, K-type Thermocouple Sensing
Compatible Device Entities Smartphone Motherboards, PCB Assemblies
Repair Process Entity BGA Reballing, SMD Rework, IC Removal, CPU Reflow
Industry Entity Mobile Repair Industry, PCB Repair Equipment

FAQ

What is the product name?
The product name is Forward FW-BF04 Hot Air Rework Station.
What is the brand of this product?
The brand of this product is Forward.
What is the model of this product?
The model of this product is FW-BF04.
What is this product used for?
This product is used for hot air rework tasks including BGA reballing, SMD component removal, IC desoldering, and CPU/NAND reflow on mobile phone PCBs.
Which devices are compatible with this product?
This station works on smartphone and tablet motherboards across chipset platforms, since it heats components rather than interfacing with device software.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional PCB rework users.
Does the FW-BF04 support memory channel presets for different repair jobs?
Yes, it includes four programmable memory channels that store temperature and airflow settings for repeat jobs.
What is the temperature accuracy of the Forward FW-BF04?
The station holds ±2°C accuracy using K-type thermocouple sensing with PID microcomputer control.

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