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Hi6555 V110 Power IC

Hi6555 V110 Power IC

Regular price Rs.200.00 PKR
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The Hi6555 V110 Power IC (marked HI6555GFCV110) is the power management IC used in the Huawei Honor 6X and GR5 Mini. It handles voltage regulation and power distribution across the board, so when a phone shows dead symptoms, charging issues, or won't boot past the logo, this chip is one of the first suspects. You get a direct replacement for board-level repair, not a generic substitute. Technicians use it during dead-board diagnosis, reballing jobs, and power-line troubleshooting where the original PM chip has failed or shorted. Order it to restock your bench or complete a repair job the same day.

⚖️ Weight: 0.01 kg

SKU:MST-IC-234

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Description

When a Honor 6X or GR5 Mini comes into your shop completely dead — no charging light, no display, nothing on the logo — the power line is usually where you start. The Hi6555 V110 power IC sits at the center of that power line. It's the PM (power management) IC that takes input from the battery and charging circuit and distributes regulated voltage to the CPU, memory, and display driver. If this chip develops a dead short or a cracked ball under reflow stress, the whole board goes dark, and no amount of software flashing fixes it.You'll usually reach for this part in one of three situations. First, a phone that's dead after a drop or liquid exposure, where continuity testing on the power rail shows a short traced back to the PMIC. Second, a board that was already reworked once and the original chip got damaged during removal or reballing. Third, a unit stuck in a boot loop or hang on logo where voltage sequencing checks point to PM chip failure rather than a software fault. In each case, swapping the Hi6555 V110 restores normal power sequencing without touching any other component on the board.This is a BGA-package IC, so reballing and hot air rework are part of the job. A stable hot air station, flux, and a steady hand under the microscope matter here — the ball pitch is tight, and a cold joint or bridged pad after reflow will bring the same dead symptoms right back. Preheat the board evenly before you lift the old chip, clean the pads thoroughly, and reball with matched solder before placing the new IC. Skipping proper board cleaning is the most common reason technicians end up reworking the same spot twice.Because it's the same part number and marking as the original factory component, you don't need to touch firmware or run any calibration after the swap — power up the board, and if reflow was clean, the phone should boot normally. That said, always verify with a multimeter or power supply box before reassembly. Feed test voltage through the charging port and check current draw; a healthy board pulls current in a predictable step pattern as it powers on. A board that still shorts or pulls excess current after the chip swap usually points to a secondary fault elsewhere, not a bad IC.Stock this alongside your other Honor 6X and GR5 Mini repair parts — display flex, charging port, and battery connector — since dead-board jobs on this model often need more than one component replaced in the same visit. Keeping a few of these on hand means you're not waiting on a supplier when a dead-phone job walks in and the customer wants same-day turnaround.This part fits directly into standard PMIC-level board repair workflow: diagnose the short with a multimeter or thermal camera, isolate it to the PM chip, remove and reball, place the new IC, then retest power draw before reassembly. It's a straightforward swap once you've confirmed the fault, and it's one of the higher-success repairs for this device family when the rest of the board is clean.

Key Features

Direct-fit replacement for the original Honor 6X / GR5 Mini power IC

Handles voltage regulation and power distribution from charging input to CPU and display

Same part marking as factory-installed chip — no firmware match needed

BGA package suited for standard hot air reballing workflow

Useful for isolating and fixing dead-after-drop or dead-after-liquid boards

Fits directly into existing dead-board diagnostic routine

Compact IC footprint keeps rework time low compared to full board swaps

Sourced for board-level repair, not casual DIY use

Specifications

Brand Entity Huawei
Product Entity Hi6555 V110 Power IC
Technology Entity Power Management IC / PMIC
Compatible Device Entities Huawei Honor 6X, Huawei GR5 Mini
Repair Process Entity PCB reballing, hot air rework, power-line diagnosis
Industry Entity Mobile Phone Repair, GSM Technician Tools

Compatible Devices

  • Huawei Honor 6X (Glory 6X) and Huawei GR5 Mini — confirmed device-level compatibility.
  • Not verified for other Huawei models.

Common Repair Uses

  • Dead board repair after short circuit,
  • no-power/no-charging diagnosis,
  • boot loop and hang-on-logo troubleshooting,
  • board rework after liquid damage, and PMIC-related power sequencing faults.

FAQ

What is the product name?
The product name is Hi6555 V110 Power IC.
What is the brand of this product?
The brand of this product is Huawei.
What is the model of this product?
The model of this product is Hi6555 V110 (HI6555GFCV110).
What is this product used for?
This product is used for board-level power management repair, replacing a faulty or shorted PM chip on the affected device.
Which devices are compatible with this product?
This product is compatible with the Huawei Honor 6X (Glory 6X) and Huawei GR5 Mini.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this IC require reballing during installation?
Yes, the Hi6555 V110 is a BGA-package chip, so it needs hot air removal and reballing rather than a direct solder-in replacement.
Can this chip fix a phone stuck on boot loop or hang on logo?
It can resolve boot loop or hang-on-logo issues caused by power sequencing failure at the PMIC, but the fault should be confirmed with power draw testing before replacement, since the same symptoms can come from other board faults.

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