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JTX BGA Reballing Stencil — 0.3/0.35/0.4/0.5mm UV Green Oil Isolation, Universal Hole Spacing

JTX BGA Reballing Stencil — 0.3/0.35/0.4/0.5mm UV Green Oil Isolation, Universal Hole Spacing

Rs.500.00 PKR
Rs.500.00 PKR
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Professional BGA reballing stencil with UV green oil isolation, supporting 0.3, 0.35, 0.4, and 0.5mm universal hole spacing. Ideal for precise and clean solder pad rework on PCBs.

MST-SOLDERING-ACCESSORIES-964

⚖️ Weight: 0.001 kg

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Description

The JTX Universal BGA Reballing Stencil is engineered for technicians who demand precision in chip-level PCB repair. Featuring UV-curable green oil isolation, this stencil creates a clean solder mask barrier on your solder pads — minimizing solder bridges and maximizing rework accuracy.

The stencil supports four universal hole spacings: 0.3mm, 0.35mm, 0.4mm, and 0.5mm — making it compatible with a wide range of BGA chips used in smartphones, laptops, graphics cards, and other electronics.

How to Use: Apply UV curing ink to the solder pad area. Place the green solder mask stencil over the pads with the correct alignment, green side facing up. Expose to a UV lamp until fully cured. The mask hardens and isolates each pad perfectly for reballing.

Whether you are a professional repair technician or an advanced hobbyist, this stencil ensures consistent, repeatable results with every use.

Key Features

  • Universal hole spacing: supports 0.3mm,
    0.35mm, 0.4mm, and 0.5mm pitch sizes
  • UV green oil isolation layer for clean,
    precise solder pad masking
  • Fast UV curing — quick setup with any
    standard UV lamp
  • Reduces solder bridges and improves
    reballing accuracy
  • Compatible with BGA chips in smartphones,
    laptops, GPUs, and more
  • Reusable design for multiple rework
    sessions
  • Easy to align — single green mask screen
    with clear orientation

Specifications

Brand JTX
Product Type BGA Reballing Stencil
Hole Spacing 0.3 / 0.35 / 0.4 / 0.5mm
Isolation Type UV Green Oil
Curing Method UV Lamp
Application PCB Solder Pad Rework / BGA Reballing
Compatible Devices Smartphones, Laptops, GPUs, Motherboards
Design Universal (Multi-Pitch)
Usage Professional / Advanced Repair

FAQ

Q1: What hole spacing sizes does this BGA reballing stencil support?
This stencil supports four universal hole spacings: 0.3mm, 0.35mm, 0.4mm, and 0.5mm — making it compatible with a wide range of BGA chips.
Q2: How do I use this UV green oil isolation stencil?
Apply UV curing ink to the solder pad, then place the green solder mask stencil over the pads with the green side facing up. Align it properly and expose to a UV lamp until fully cured.
Q3: What type of lamp is needed to cure this stencil?
A standard UV lamp is required to cure the green oil isolation layer. No special or expensive equipment is needed.
Q4: Is this stencil compatible with smartphone and laptop BGA chips?
Yes, this stencil is compatible with BGA chips found in smartphones, laptops, graphics cards, motherboards, and other electronic devices.
Q5: Can this stencil be reused multiple times?
Yes, the stencil is designed for multiple rework sessions, making it a cost-effective tool for professional repair technicians.
Q6: What is the purpose of the UV green oil isolation layer?
The UV green oil isolation layer acts as a solder mask barrier on the pads, preventing solder bridges and ensuring clean, accurate reballing results.
Q7: Is this product suitable for beginners?
This stencil is best suited for professional technicians or advanced hobbyists with prior experience in BGA chip rework and PCB repair.