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JTX BS-2 Half-Blade 11-in-1 Multi-Functional High-Toughness Steel Blade Set for Mobile PCB & IC Repair

JTX BS-2 Half-Blade 11-in-1 Multi-Functional High-Toughness Steel Blade Set for Mobile PCB & IC Repair

Regular price Rs.1,250.00 PKR
Regular price Sale price Rs.1,250.00 PKR
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The JTX BS-2 Half-Blade Set gives your repair bench an 11-blade arsenal purpose-built for mobile phone PCB work. Each blade uses high-toughness steel engineered for CPU glue removal, IC chip prying, black adhesive scraping, BGA pad cleaning, and FPC connector work. The half-blade profile delivers tighter access angles in confined motherboard zones where full-size blades simply cannot reach. Whether you are tackling charging IC change karna, CPU degumming, or NAND prying on dead-after-flash boards, this set covers every critical repair scenario in one compact kit.

SKU:MST-SOLDERING-ACCESSORIES-972

⚖️ Weight: 0.25 kg

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Description

Every technician working on hardware fault repairs at the component level knows that the blade in your hand directly determines whether the job ends cleanly or damages the motherboard beyond recovery. The JTX BS-2 takes a workflow-first approach to blade design — the half-blade profile is not a shortcut, it is a deliberate engineering choice that gives you more controlled leverage in the tight spaces where premium smartphones pack their most sensitive IC components.

Eleven distinct blade profiles ship in this set, each shaped to match a specific repair task on the mobile phone motherboard. When you pull a board with a charging issue caused by a faulty PMIC or charging IC, removing the underfill and black glue without lifting adjacent components is the most critical step. The BS-2 includes flat scraping blades sized for exactly this work — wide enough to cover the IC footprint in fewer passes, thin enough to slip cleanly under the chip without wedging into the PCB substrate.

The half-blade geometry sets this kit apart from conventional full-length repair blades. A standard blade applies force across its full length, which creates uncontrolled flex and unpredictable tip behavior when you are working under a microscope on a 0.1mm trace area. The BS-2's half-blade format concentrates stiffness at the tip while keeping the overall weight low, so your hand movements translate directly into precise blade actions — no bounce, no slip. Pakistani technicians doing IC change karna on high-volume repair benches will immediately recognize how much this improves consistency across multiple jobs.

High-toughness steel construction means these blades resist chipping and micro-cracking even after repeated use in heating and cooling cycles common on a hot air station workflow. When you heat a CPU or NAND chip for removal, the blade that goes underneath immediately contacts that elevated temperature. Low-grade blades lose their temper edge after a few heat cycles and start chipping — those chips land on your PCB and can short traces. The BS-2's steel formulation handles heat-adjacent work without degrading, which protects your PCB repair quality over the long term.

The 11-piece configuration covers the full spectrum of board-level blade operations. Pointed-tip blades handle precise adhesive cutting at IC corners. Flat-edge blades handle broad glue removal across CPU underfill zones. Angled blades work at mid-frame and connector-edge positions where a straight approach is impossible. Hook-profile blades get underneath FPC connectors and battery contacts for safe prying without bending the connector housing. This variety means you stop switching between multiple individual tools mid-repair and keep your workflow moving without interruption.

For technicians working on boot loop issues and hang on logo faults that require NAND chip replacement, accurate chip removal without PCB pad damage is non-negotiable. The BS-2's low-profile blades let you slide under the NAND package at the correct angle and use consistent horizontal pressure — the geometry guides the blade path so you are not forcing a tip that wants to dig down into the board. On Samsung, Xiaomi, OPPO, Vivo, and iPhone boards this makes the difference between a recovered motherboard and a scrapped one.

Pair this blade set with a hot air station for chip removal, a microscope for precision visual control, a reballing kit for BGA chip reinstallation, and a PCB holder to keep the board stable during all blade work. This is the standard four-tool cluster for professional CPU and IC repair, and the BS-2 integrates into that workflow without requiring any adaptation. Soldering stations and multimeters complete your diagnostic chain before and after component-level repair. The BS-2 earns its place as the blade layer of that setup — the tool you reach for every single time a chip needs to move.

Repair shop owners sourcing for high-volume workshop environments will find that the 11-blade configuration reduces per-technician tool turnover. Instead of ordering individual blades as specific shapes wear out, your bench carries the full profile range from day one and technicians rotate through the correct shape for each job without improvising.

Key Features

  • 11 distinct half-blade profiles covering every major PCB and IC repair operation in one kit
  • High-toughness steel construction resists chipping, micro-cracking, and edge deformation after repeated heat-adjacent use
  • Half-blade geometry concentrates stiffness at the working tip for precise, controlled blade action under microscope conditions
  • Flat scraping blades sized for broad CPU and PMIC underfill removal in minimal passes without PCB substrate contact
  • Pointed and angled tip variants handle corner adhesive cutting and mid-frame IC edge work at difficult approach angles
  • Hook-profile blades safely pry FPC connectors and battery contacts without bending or cracking connector housings
  • Reusable and cleanable — wipe clean between operations for consistent performance across high-volume workshop use
  • Compatible with the full range of modern smartphone platforms including iPhone and Android brands dominant in Pakistan's repair market

Specifications

Brand JTX (JTXTOOLS)
Model BS-2
Category Mobile Repair Blade Set / PCB Repair Hand Tools
Blade Count 11 pieces
Blade Profile Half-Blade Design
Material High-Toughness Steel
Compatibility iPhone, Samsung, Xiaomi, OPPO, Vivo, Huawei, Android Smartphones
Application CPU Glue Removal, IC Chip Prying, BGA Pad Cleaning, FPC Connector Work, Black Adhesive Scraping, Underfill Removal

FAQ

What is the product name?
The product name is JTX BS-2 Half-Blade 11-in-1 Multi-Functional High-Toughness Steel Blade Set.
What is the brand of this product?
The brand of this product is JTX, also known as JTXTOOLS, a professional mobile repair tool manufacturer.
What is the model of this product?
The model of this product is BS-2.
What is this product used for?
This product is used for CPU glue removal, IC chip prying, BGA pad cleaning, FPC connector prying, black adhesive scraping, and underfill removal during mobile phone PCB and motherboard-level repair.
Which devices are compatible with this product?
This product is compatible with iPhone, Samsung, Xiaomi, OPPO, Vivo, Huawei, and all major Android smartphone brands commonly repaired in Pakistan's mobile repair market.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, hardware engineers, and professional users performing component-level PCB repair.
Can the JTX BS-2 blades handle CPU glue removal on iPhones and Android boards without lifting PCB pads?
Yes — the BS-2's flat half-blade profiles are designed for controlled horizontal scraping across CPU underfill zones. The blade geometry guides pressure along the board surface rather than into it, which protects PCB pads during chip removal on both iPhone and Android motherboards.
Is the JTX BS-2 blade set suitable for IC change karna when working with a hot air station, and do the blades hold up after repeated heat-cycle exposure?
The BS-2 blades are made from high-toughness steel that resists edge degradation after exposure to the elevated temperatures generated during hot air chip removal. You can slide a BS-2 blade underneath a heated IC without the tip chipping or losing its profile — making this set reliable for high-frequency IC replacement work in a professional workshop environment.