Mechanic 004 CPU IC Glue Remover Cutting Blades Set

When a phone lands on your bench as a dead phone or stuck on a hang on logo problem, and the fault traces back to the CPU, NAND, or a power IC, the real fight starts with the glue, not the solder. Chip makers flood the space under BGA processors with underfill epoxy, and iPhone boards from the A8 through A12 generation carry heavy black sealant around the CPU and memory packages. The Mechanic 004 CPU IC Glue Remover Cutting Blades Set targets exactly that stage of the job. You get one double-ended alloy handle and four steel blades, and each blade shape handles a different part of the glue removal workflow. The crescent (half-moon) knife follows the curved edge of an A8, A9, A10, A11, or A12 CPU, so you can cut the underfill line around the package without slipping onto nearby capacitors. The crooked knife works as a pry and cleaning tool for motherboard sealant, which helps when you separate a chip layer or lift the edge of an IC after heating. The crooked shovel knife scrapes softened UV glue and black epoxy off the board surface in wide strokes, and the scraping knife clears leftover solder paste and glue residue from BGA pads before you reball or place a new IC. Mechanic grinds each cutting edge by hand and builds the blades from 0.1mm imported AAAA-grade steel, which gives you a thin edge that flexes instead of snapping when you work it under a chip corner. The steel resists heat and wear, so you can keep cutting glue while your hot air station brings the board up to temperature. A 5µm nickel layer topped with real gold plating protects the blades from oxidation and corrosion, which matters in Pakistani workshops where humidity and flux fumes dull ordinary steel within weeks. In a normal CPU or NAND swap, the routine runs like this: you mount the board in a PCB holder, apply flux, heat the area, run the crescent blade around the chip edge to break the underfill bond, then lift the chip once the solder melts. After removal, you switch to the shovel and scraper blades to strip the remaining epoxy, then clean the pads with your soldering station and wick so they come out flat and ready for the reballing kit. Rushing this stage is how technicians rip pads and turn a simple IC change into a jumper job, and a sharp, thin blade cuts that risk down sharply. On Android boards from Samsung, Oppo, Vivo, Infinix, and Tecno, the same blades handle any underfilled chip, from eMMC or UFS memory to PMIC and charging ICs, because the glue removal technique stays the same even when the board layout changes. Shops that handle memory work usually pair this set with eMMC programmers, UFS adapters, and ISP pinout tools, since every chip-off read or memory replacement begins with a clean removal. Under a microscope, the crescent edge lets you see exactly where the blade meets the glue line, so you control the depth instead of guessing. After the rework, a multimeter check across the pads and a power-up on a test box confirm the board survived the job. The double-ended handle keeps two blades ready at once, so you flip the handle instead of stopping mid-job, which saves real time when the shop has a queue of charging issue, network issue, and boot loop issue phones waiting. For a new technician learning chip-level hardware fault repair, this set builds the correct glue removal habit from the first job. For a busy service center, it becomes the tool every bench picks up before the hot air even comes on. If you run board-level repair anywhere in Pakistan and still dig out underfill with a bent tweezer tip or a broken surgical blade, the Mechanic 004 set gives you a cleaner, safer, and faster method for every CPU, NAND, and IC job on your repair bench.