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Brand: MECHANIC

Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1

Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1

Regular price Rs.999.00 PKR
Regular price Sale price Rs.999.00 PKR
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The Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1 gives your repair bench a fast, controlled way to strip black epoxy and underfill from CPU pads, IC footprints, and layered motherboards. Each spade blade uses 0.3 mm imported AAAA steel with a sharp, wear-resistant edge that lifts stubborn glue in one clean stroke without gouging the board surface. The quick-change design lets you swap a dull blade in seconds instead of replacing the whole tool. Technicians in Lahore, Karachi, and Islamabad rely on this set for chip prying, CPU layer separation, and pad cleaning before reballing and IC change work.

SKU:MST-SOLDERING-ACCESSORIES-879

⚖️ Weight: 0.09 kg

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Description


Every technician who has lifted a CPU off a dead phone knows the real work starts after the chip comes off, because the black underfill left on the pads decides whether your reball job sits flat or fails on the next power-up. The Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1 targets exactly that stage of board-level repair. Mechanic builds each blade from 0.3 mm imported AAAA steel, and that thin profile lets the edge slide under hardened epoxy at a low angle, so you shave the glue off the pad field instead of digging into it. The sharp edge holds up across repeated jobs, and when it finally dulls, the quick-change spade design lets you fit a fresh blade and get back to the board in seconds. That matters in a busy Pakistani repair shop where one bench might handle a hang on logo phone, a boot loop issue, and a charging issue before lunch. Think about a typical CPU or eMMC swap. You heat the area with your hot air station, lift the chip, and then face a pad field covered in underfill that the manufacturer applied to lock the BGA joints in place. If you attack that residue with a random cutter or a heavy scraper, you risk ripping pads, scratching solder mask, or cutting a fine trace near the chip footprint, and one torn pad turns a simple IC change into a jumper job. The FS-51 spade shape spreads your scraping force across a wide, flat edge, so you clear the residue in controlled strokes and keep the pads intact for the next step. Follow up with your soldering station and flux to level the pads, and the board comes out ready for reballing. The same blade handles chip prying on glued components. Modern phone boards anchor processors, memory chips, and power ICs with strong adhesive, and a thin steel spade slips into that gap once you soften the glue with heat, letting you lift the part without cracking the package or pulling the pads beneath it. On layered sandwich motherboards, you can work the blade along the glued seam during CPU layer disassembly, separating the layers gradually instead of forcing them apart and damaging the interposer pads. The anti-static stainless steel build suits work around sensitive ICs, so your bench practice stays consistent whether you handle a memory chip, a PMIC, or a full logic board. This set belongs in the rework corner of your toolkit, right next to the tools that already handle heat and precision. Work under your microscope when you clear underfill around tiny passives, because a clear view of the edge lets you stop right at the pad surface. Clamp the board in one of your PCB holders so it stays steady while you push the blade across the pad field. After cleaning, move to your reballing kits to restore the BGA, then check the lines with your multimeters before you power the phone. When the hardware fault traces back to the storage chip, clean pads prepare the board for programming through eMMC programmers, UFS adapters, or ISP pinout tools, and your test boxes then take over for flashing, FRP lock removal, or pattern unlock once the phone boots again. In short, the blade sits at the point where hardware repair hands over to software work, and a clean pad field decides whether that handover succeeds. The 5in1 set format keeps spare blades on your bench, so a single worn edge never stops a job halfway through a customer's board. Repair shop owners who train new staff also benefit, because a dedicated glue removal blade teaches the correct low-angle scraping habit from day one instead of letting juniors experiment with general-purpose cutters on expensive boards. For anyone searching for a glue removal blade price in Pakistan, the value comes down to three things: a thin, sharp steel edge that respects the pads, a replaceable blade system that keeps running costs low, and a shape built for CPU and IC work rather than screen separation. If you run a repair shop in Lahore, Karachi, Islamabad, or any other city and you regularly handle CPU, eMMC, or UFS jobs, the Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1 from KB GSM Store gives you a purpose-built tool for underfill removal, so you stop sacrificing ordinary blades on a job they were never designed for and start delivering cleaner, more reliable board repairs to every customer who walks in with a dead phone.

Key Features

  • Spade-style blade built for fast removal of residual glue from CPU motherboard pads
  • Blades made from 0.3 mm imported AAAA steel for a thin, sharp working edge
  • Wear-resistant edge that stays sharp through repeated scraping jobs
  • Quick-change design lets you replace a worn blade in seconds and extend tool life
  • Clears stubborn adhesive in a single stroke without damaging the board surface
  • Anti-static stainless steel construction suited to work around sensitive ICs
  • Multi-purpose use for glue removal, cutting, scraping, chip prying, and CPU layer disassembly
  • 5in1 set format keeps spare blades ready on the repair bench

Specifications

Brand Entity Mechanic
Product Entity Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1
Technology Entity Anti-static stainless steel quick-change spade blade, 0.3 mm AAAA steel edge
Compatible Device Entities Mobile phone motherboards, CPU and IC pad areas, layered (sandwich) logic boards, PCBs
Repair Process Entity Underfill/glue removal, chip prying, CPU layer disassembly, pad cleaning before reballing
Industry Entity Mobile phone repair, PCB repair, board-level rework

Compatible Devices

  • Universal — not device-specific
  • Mobile phone motherboards with glued or underfilled CPU, memory, and IC components
  • Layered (sandwich) motherboards that require CPU layer disassembly
  • General PCBs with adhesive residue on pads or around chips

Common Repair Uses

  • Removing black underfill and glue residue from CPU pads after chip removal
  • Cleaning eMMC, UFS, and IC footprints before reballing and IC change work
  • Prying glued chips off the board after softening adhesive with hot air
  • Separating layered motherboards during CPU layer disassembly
  • Scraping and cutting adhesive on PCBs during general rework

FAQ

What is the product name?
The product name is Mechanic FS-51 Glue Removal Quick Spade Blade (Set) 5in1.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is FS-51.
What is this product used for?
This product is used for removing glue and underfill from CPU and IC pads, chip prying, scraping, cutting, and CPU layer disassembly on mobile phone motherboards.
Which devices are compatible with this product?
This product is compatible with mobile phone motherboards and PCBs universally, as it is a hand tool and not device-specific.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What blade thickness and steel does the Mechanic FS-51 use?
The FS-51 blades use 0.3 mm imported AAAA steel, which gives a thin, sharp edge that slides under hardened underfill at a low angle.
Can I replace the blades on the Mechanic FS-51 when they get dull?
Yes. The FS-51 uses a quick-change spade design, so you can swap a worn blade quickly instead of replacing the entire tool.
Can I use the FS-51 to separate a sandwich motherboard?
Yes. The blade supports CPU layer disassembly, letting you work along the glued seam gradually after applying heat rather than forcing the layers apart.