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Mechanic HX T100 (0.4mm) Solder Wire 55gram

Mechanic HX T100 (0.4mm) Solder Wire 55gram

Regular price Rs.650.00 PKR
Regular price Sale price Rs.650.00 PKR
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The Mechanic HX-T100 0.4mm Solder Wire is a fine-diameter Sn63/Pb37 tin wire built for precision mobile phone repair and PCB rework. Each 55-gram spool delivers a low 183°C melting point, 1.0–3.0% built-in rosin flux, and less than 0.1% chlorine ion content, giving technicians clean, bright, spatter-free solder joints on delicate motherboard components. The 0.4mm diameter suits fine-pitch IC legs, small connectors, and micro jumper work where thicker wire is impractical. Reliable wetting and low oxidation resistance make it ideal for board-level repair, charging port rework, and general electronics soldering. Trusted by GSM technicians for consistent flow and minimal residue on repair benches across Pakistan's mobile service centers.

SKU:MST-SOLDERING-ACCESSORIES-336

⚖️ Weight: 0.01 kg

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Description

Working on a dead board or a stubborn charging fault demands solder that flows the moment your iron touches down, and the Mechanic HX-T100 0.4mm Solder Wire is built around exactly that requirement. This 55-gram spool uses a Sn63/Pb37 tin-lead alloy, the same ratio trusted across the mobile repair industry for its predictable eutectic melting behavior at around 183°C. That low melting point means you spend less time holding heat on sensitive ICs and PCB pads, reducing the risk of lifted traces or thermal damage during IC change or jumper lagana work on tightly packed boards. The built-in rosin core carries 1.0–3.0% flux content with a chlorine ion level below 0.1%, so the wire actively cleans oxidation off pads and component legs as it melts, cutting down on the extra flux paste you'd otherwise need to dab on for every joint. A 75% expansion rating on the core keeps flux distribution even along the entire length of the spool, so joint quality stays consistent whether you're soldering the first meter of wire or the last. The 0.4mm diameter puts this spool firmly in fine-pitch territory. It's thin enough to control precisely under a microscope or magnifier when you're reattaching a display flex connector, repairing a charging port pad, or laying a jumper wire across a cracked trace, yet it carries enough solder mass per pass to build a solid joint without repeated feeding. Technicians dealing with hang on logo boards, dead after flash symptoms, or intermittent charging issue complaints often find that board-level rework is where the real diagnosis happens, and having a wire this fine on the bench makes the difference between a clean repair and a bridged, unusable pad. Because the flux is embedded in the core rather than applied separately, solder joints come out bright and full with minimal spatter, which matters when you're working inches away from other populated components on a densely packed motherboard. No-clean, low-residue flow also means less post-repair cleanup with isopropyl alcohol, so you can move from one repair straight to the next without scrubbing flux residue off the board every time. This spool fits naturally into a soldering station setup alongside a temperature-controlled iron, tweezers, and a PCB holder, and it pairs well with hot air rework when you need to combine wire soldering with reflow on the same board. It's equally useful for general circuit board soldering repair outside mobile devices, since the Sn63/Pb37 composition and rosin core behave predictably on standard copper pads regardless of the device category. For a repair shop running through multiple boards a day, consistency matters more than any single joint looking good, and this alloy ratio has stayed a industry standard specifically because it behaves the same way every time, spool after spool. Keep the wire in a dry environment away from direct heat or humidity to preserve flux activity over time, since flux-cored wire can lose potency if stored carelessly on an open bench. Whether you're a technician handling walk-in charging issue repairs, a service center doing bulk board-level rework, or a hobbyist working through smaller electronics projects, this 0.4mm HX-T100 spool gives you fine control with dependable melt and flow characteristics suited to precision mobile repair work.

Key Features

  • Sn63/Pb37 tin-lead alloy for reliable, low-temperature soldering
  • 0.4mm fine diameter suited to precision fine-pitch repair work
  • Built-in rosin core flux at 1.0–3.0% for active pad cleaning
  • Low melting point of approximately 183°C reduces board heat exposure
  • Chlorine ion content below 0.1% for low-corrosion, clean joints
  • 75% expansion ratio ensures even flux distribution along the wire
  • 55-gram spool sized for regular repair bench use
  • Bright, spatter-free solder joints with minimal post-solder residue

Specifications

Brand Entity Mechanic
Product Entity HX-T100 0.4mm Solder Wire
Technology Entity Sn63/Pb37 Rosin Core Solder Alloy
Compatible Device Entities Universal – Mobile Phone Motherboards and PCBs
Repair Process Entity IC Soldering, Jumper Wire Repair, PCB Rework
Industry Entity Mobile Repair Industry, Electronics Repair

Compatible Devices


Universal – not device-specific; suitable for mobile phone motherboards, PCBs, and general electronics circuit boards across all brands and chipsets.

Common Repair Uses


IC change and reattachment, jumper wire repair on damaged traces, charging port pad rework, display flex connector soldering, general motherboard soldering and board-level repair.

FAQ

What is the product name?
The product name is Mechanic HX-T100 0.4mm Solder Wire, 55g.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model is HX-T100.
What is this product used for?
This product is used for precision soldering during mobile phone motherboard repair and general PCB rework.
Which devices are compatible with this product?
It is universal and works across mobile phone motherboards and general electronic circuit boards regardless of brand or chipset.
Who should use this product?
This product suits mobile repair technicians, repair shops, service centers, and professional electronics repair users.
What is the tin-to-lead ratio in this solder wire?
This wire uses a Sn63/Pb37 ratio, with 63% tin and 37% lead.
Is the flux built into the wire, or does it need to be applied separately?
The flux is built into the rosin core at 1.0–3.0% content, so no separate flux application is needed for standard joints.