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MECHANIC iBGA Max 6 in 1 Middle Frame Reballing Platform – iPhone X to 11 Pro Max

MECHANIC iBGA Max 6 in 1 Middle Frame Reballing Platform – iPhone X to 11 Pro Max

Regular price Rs.5,500.00 PKR
Regular price Sale price Rs.5,500.00 PKR
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The MECHANIC iBGA Max 6 in 1 gives you a dedicated middle frame reballing setup for iPhone X, XS, XS Max, 11, 11 Pro, and 11 Pro Max logic boards. You get automatic magnetic positioning that locks the motherboard and RF small board in place before tin planting, so you're not fighting misalignment mid-reballing. Six configurations in one platform mean you stop juggling separate fixtures for every iPhone model on your bench. Built for technicians doing dead-after-flash recovery, board-level repair, and RF small board rework, it speeds up reballing without stressing the pads or the board itself. A straightforward addition to any GSM repair bench running iPhone board-level work.

SKU:MST-SOLDERING-TOOLS-1379

⚖️ Weight: 0.02 kg

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Description

If you repair iPhone motherboards regularly, you already know a wobbly reballing setup ruins more boards than bad solder does. The MECHANIC iBGA Max 6 in 1 exists to fix exactly that problem — it holds the middle frame and logic board steady while you replant tin on X, XS, XS Max, 11, 11 Pro, and 11 Pro Max boards.

Why middle frame positioning matters

iPhone X-series boards ditched the single-piece logic board design and moved to a middle frame sandwiched between the main board and the RF small board. That means reballing isn't a flat, single-surface job anymore — you're aligning two board layers around a frame, and any shift during tin planting throws off ball placement on both sides. This platform's automatic positioning locks that frame so your stencil sits exactly where it needs to, every time.

Magnetic hold, not clamp pressure

Instead of relying on mechanical clamps that can flex or slip under heat, the iBGA Max 6 in 1 uses magnetic attraction to keep the board and stencil seated. That matters when you're running a hot air station over the board — clamps that loosen as the platform heats up are how technicians end up with bridged balls or boards that need a redo. Magnetic hold stays consistent through the heat cycle.

One platform, six board configurations

The "6 in 1" isn't marketing filler — it covers X, XS, XS Max, 11, 11 Pro, and 11 Pro Max, so you're not stocking six separate reballing jigs for every model that walks through the door. Swap the positioning setup for the board you're working on and move straight into reballing. For a shop handling mixed iPhone repair volume, that's real bench space and setup time saved.

Where this fits in your workflow

You'll reach for this after board separation, once you've identified the fault as IC-related or determined the middle frame layer needs reballing — dead after flash, no power after liquid damage, or RF small board issues where the network IC or PA modules need reflow. Position the board, apply your stencil, run your hot air station, and let the platform's positioning keep everything aligned through cooldown. It's not a standalone repair tool — it's the fixture that makes your existing hot air station or reflow setup actually usable for middle-frame-generation iPhones.

Built for repeat use

A reballing platform gets heated repeatedly, day after day, on a busy bench. The magnetic base and positioning plates on the iBGA Max 6 in 1 are built to take that repeated thermal cycling without losing alignment accuracy — which is the entire point of buying a dedicated platform instead of improvising with tape and a flat surface.

Who this is for

If your shop does board-level iPhone repair — chip-off, IC replacement, RF module rework — and you're still working X-11 Pro Max volume (which is still common across Pakistan's repair market), this platform pays for itself the first time it saves you a board you'd otherwise have scrapped from a shifted reball. It's a bench essential, not a nice-to-have, for anyone doing serious mobile PCB repair on these models.

Key Features

  • Automatic magnetic positioning for middle frame and logic board
  • Covers 6 iPhone models in a single platform (X, XS, XS Max, 11, 11 Pro, 11 Pro Max)
  • Keeps board and stencil aligned through hot air reflow cycles
  • Removes the need for separate reballing jigs per iPhone model
  • Stable magnetic hold instead of mechanical clamp pressure
  • Supports both main logic board and RF small board reballing
  • Built for repeated daily use on a repair bench
  • Speeds up middle-frame reballing without added board stress

Specifications

Brand Entity MECHANIC
Product Entity iBGA Max 6 in 1 Middle Frame Reballing Platform
Technology Entity Magnetic positioning / BGA reballing
Compatible Device Entities iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max
Repair Process Entity Middle frame reballing, RF small board rework, PCB board-level repair
Industry Entity Mobile Repair Industry / GSM Technician Tools

Compatible Devices


iPhone X, iPhone XS, iPhone XS Max, iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max — logic board and RF small board positions

Common Repair Uses


Middle frame BGA reballing, motherboard-to-RF-small-board layer separation and realignment, RF small board tin replanting, PCB positioning during hot air rework

FAQ

What is the product name?
The product name is MECHANIC iBGA Max 6 in 1 Middle Frame Reballing Platform.
What is the brand of this product?
The brand of this product is MECHANIC.
What is the model of this product?
The model is iBGA Max 6 in 1.
What is this product used for?
This product is used for middle frame BGA reballing and tin planting on iPhone logic boards and RF small boards.
Which devices are compatible with this product?
This product is compatible with iPhone X, XS, XS Max, 11, 11 Pro, and 11 Pro Max.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional GSM technicians.
Does this platform work for RF small board reballing on iPhone 11 series?
Yes, it holds the RF small board in position for tin planting alongside the main logic board on X-11 Pro Max models.
Do I still need a hot air station to use this platform?
Yes, the platform holds the board and stencil in position — you run your own hot air or reflow station to actually melt and reball the tin.

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