Mechanic IBGA Max 6 IN 1 Tin planting Platform X-11PM

When an iPhone X, XS Max or 11 Pro Max lands on your bench as a dead phone after a drop, or shows no service right after a back glass job, the fault very often sits between the two layers of the sandwich board, and the Mechanic IBGA Max 6 IN 1 Tin planting Platform X-11PM gives you a stable, repeatable way to rebuild those middle-layer solder joints instead of fighting a loose stencil with tweezers. Apple stacked the logic board on these models, so once you separate the layers on a preheater or hot air station, every pad on the interposer side needs fresh, even solder balls before the board can go back together, and that is exactly the job this fixture handles. Mechanic built the platform around six board profiles in one base: the X, XS and XS Max motherboard, plus the RF small board of the iPhone 11, 11 Pro and 11 Pro Max, so a single tool covers the layered iPhones that still regularly come into Pakistani repair shops. The base uses strong magnets to pull the board into its positioning slot automatically, which means the stencil holes line up with the pads without you nudging the board millimetre by millimetre under the microscope. Double-sided positioning slots let you seat the board in the correct orientation for the side you are working on, and the board stays put while you spread solder paste and heat it, so you never chase a sliding PCB around the bench. A raised anti-leakage barrier around the stencil area keeps paste where you put it, so you avoid stray balls bridging neighbouring pads or rolling under nearby components, a problem that turns a simple reball into a second round of cleaning. Mechanic designed the stencil to resist warping under hot air, so it does not bulge in the middle when you apply heat, and a flat stencil means even ball height across the whole pad array, which matters when the two layers need full contact to restore network, Wi-Fi, charging and boot. The tin planting section is integrated yet removable, so you can plant balls with the stencil in place, lift it off cleanly once the paste reflows, and move straight to inspection. In a typical workflow you clean old solder off the separated board with a soldering station and desoldering wick, apply flux, mount the board on the platform, spread a thin layer of solder paste with a scraper, heat with your hot air station until the paste melts into round balls, let it cool, then remove the stencil and check every ball under a microscope before you rejoin the layers. That routine saves real time on a busy counter in Lahore, Karachi or Islamabad, where a sandwich board repair often decides whether a customer's iPhone comes back to life or goes into the dead-board box. The fixture measures 97 × 76 × 20 mm, so it sits comfortably on a standard repair mat beside your PCB holders and reballing kits without hogging space. For a complete layered-board setup, pair it with a quality hot air station for separation and reflow, a soldering station for pad cleaning, a stereo microscope for inspection, and a multimeter to check the board for short circuits before and after the rebuild; when the fault turns out to be in storage rather than the interposer, you can move on to ISP pinout tools, eMMC programmers, UFS adapters and test boxes from the same KB GSM Store catalogue. Shop owners who handle iPhone board work regularly will find this platform earns its place quickly, because a correct middle-layer reball avoids repeat jobs, reduces wasted solder paste and protects fragile pads that tear easily when you rework them twice. If you are building up your iPhone board repair section, or you want to stop losing jobs on drop-damaged X to 11 Pro Max units with hang on logo, boot loop or no network faults, the Mechanic IBGA Max 6 IN 1 Tin planting Platform X-11PM is a practical, workshop-ready addition that keeps your reballing accurate, clean and fast.