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Brand: MECHANIC

Mechanic ISM3 Solder Paste 138% Jumper Wire Paste 3ml

Mechanic ISM3 Solder Paste 138% Jumper Wire Paste 3ml

Regular price Rs.750.00 PKR
Regular price Sale price Rs.750.00 PKR
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Mechanic ISM3 Solder Paste 138% gives you a dedicated 3ml jumper wire paste for PCB repair on your bench. Mechanic rates it at 138°C, so you work with a lower-temperature joint when you tin pads and fix broken tracks on phone, laptop, and motherboard boards. You get a small, easy-to-handle pack that suits charging issue, display problem, and network issue repairs where a jumper lagana job saves the board. Use it alongside your soldering station, hot air station, and microscope for clean results on CPU and BGA chip welding repair. Order it from KB GSM Store and keep a spare on your repair bench.

SKU:MST-SOLDERING-ACCESSORIES-1130

⚖️ Weight: 0.05 kg

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Description

Mechanic ISM3 Solder Paste 138% is a 3ml jumper wire solder paste from Mechanic that targets the small repairs eating your time on the repair bench. When a trace breaks under a chip or a pad lifts after a hard fall, you cannot always rebuild the track, so you run a thin jumper wire from point to point and tin the joint cleanly. This paste gives you a dedicated material for that job instead of forcing a general paste to do it. Mechanic rates the ISM3 at 138°C, which puts it at the low-temperature end of its jumper wire range, while the 183°C ISM5 covers the higher end. If you handle charging issue, display problem, and network issue boards every day, you know a clean jumper lagana job often decides whether a dead phone comes back to life or goes back to the customer unrepaired. Heat control matters most on a crowded phone board. Hot air and iron heat travel through the PCB, so every extra degree near a CPU, a flash IC, or a small capacitor raises the risk of lifting a neighbouring part. A 138°C paste asks for less heat at the joint than a 183°C paste, so you keep more margin around heat-sensitive components. You still decide the result with your own technique. Keep your iron tip clean, set a sensible temperature, and watch the joint under your microscope until the paste flows and settles into a smooth, shiny connection. The paste form gives you control that solder wire cannot match on tiny pads. You place a small amount on the solder spot with your iron tip or a fine tool, lay the jumper wire into it, and heat the joint until it flows. You do not cut solder wire into tiny lengths or chase a ball of tin across the pad. On a busy day at the shop, that saves minutes on every board, and those minutes add up across a full day of hardware fault jobs. Mechanic positions this paste for mobile phone repair, laptop repair, and motherboard CPU and BGA chip welding repair, so it fits technicians who work across more than one device family. In a normal workflow, you first read the fault with your DC power supply and multimeter, find the broken line, and scrape the coating to expose clean copper. You then tin the pad with ISM3, set the jumper wire, and press it down with your tweezers while the joint cools. After that, you inspect the repair under the microscope, clean the area, and test the board before you close the phone. If a pad breaks off during an ISP or eMMC job, the same jumper method rebuilds the connection so you can carry on with your IC change karna or reballing work. Pair the paste with the tools that make it work properly. A good soldering station with a fine tip gives you controlled heat for the joint, a hot air station helps when you need to move nearby parts first, and a PCB holder keeps the board steady while you work. Flux, a fine tweezer set, and a reballing kit sit in the same drawer for the repairs that follow. Choose ISM3 when your board and the parts around it prefer a cooler joint, and look at the 183°C ISM5 when your job calls for a higher-temperature paste. The 3ml pack stays compact in your toolbox and suits shops that run frequent small jumper jobs rather than large reflow batches. For technicians who search for the Mechanic ISM3 price in Pakistan, KB GSM Store lists it as a practical consumable you reorder as your bench volume grows. Close the pack after every use, keep your tip clean, and work in a ventilated space, because soldering fumes do not belong in your lungs. Test the joint with a light tug of your tweezers and a continuity check on your multimeter before you hand the phone back, since a jumper that looks good but fails continuity costs you a return visit.

Key Features

  • Dedicated jumper wire solder paste for PCB repair
  • 138°C temperature rating for lower-heat joints
  • Compact 3ml pack that fits any repair bench drawer
  • Suits mobile phone, laptop, and motherboard repair
  • Supports CPU and BGA chip welding repair work
  • Paste form lets you place a small amount exactly on the solder spot
  • Works with your soldering iron tip for tinning pads and fixing jumper joints

Specifications

Brand Entity Mechanic
Product Entity Mechanic ISM3 Solder Paste 138% (iSm3 Jumper Wire Solder Paste, 3ml)
Technology Entity Low-temperature 138°C jumper wire solder paste
Compatible Device Entities Mobile phone, laptop, and motherboard PCBs (CPU and BGA chip welding repair)
Repair Process Entity Jumper wire soldering, PCB trace repair, CPU and BGA chip welding repair
Industry Entity Mobile repair industry, PCB repair

Compatible Devices

  • Mobile phone motherboards (jumper wire repair)
  • Laptop motherboards
  • Motherboard CPU and BGA chip welding repair
  • Universal — not device-specific

Common Repair Uses

  • Jumper wire repair on broken tracks and lifted pads on mobile phone boards
  • Fixing charging issue, display problem, and network issue boards where a trace breaks
  • Tinning pads before you set a jumper wire (jumper lagana)
  • Laptop motherboard jumper wire soldering
  • CPU and BGA chip welding repair on motherboards

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