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Brand: MECHANIC

Mechanic iSm5 183℃ Specific Paste For Jumper Wire

Mechanic iSm5 183℃ Specific Paste For Jumper Wire

Regular price Rs.700.00 PKR
Regular price Sale price Rs.700.00 PKR
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The Mechanic iSm5 183℃ Specific Paste For Jumper Wire gives mobile repair technicians a dedicated 3ML solder paste for jump wire and flying line work on phone motherboards. Its nano compound formula delivers high activity and moderate viscosity, so a small dab on the pad lets your iron tip tin the joint in a single touch. It works across a 183℃–210℃ range, fills the pad fully, and leaves clear, transparent residue that keeps your jumper alignment visible under the microscope. Use it for fingerprint line repair, battery connector and charging port pads, and stubborn pads that refuse solder after underfill removal. Three dispensing needles come in the pack.

SKU:MST-SOLDERING-ACCESSORIES-624

⚖️ Weight: 0.05 kg

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Description

Every board-level technician knows the moment a trace lifts, a pad tears away during IC removal, or a fingerprint line goes open, and the fix comes down to a jumper wire thinner than a hair, which is exactly the job the Mechanic iSm5 183℃ Specific Paste For Jumper Wire handles on your repair bench. Mechanic built this 3ML paste specifically for jump wire and flying line soldering, so it behaves differently from the general-purpose solder paste you use for reballing or stencil work. The nano compound formula gives the paste a high activity factor, so the flux attacks oxidation quickly and lets molten solder wet the copper instead of balling up on the surface. Moderate viscosity keeps the paste exactly where you place it, so a tiny pick on the solder point stays put while you bring the iron in, and a single touch of the tip tins the joint completely. That single-touch behaviour matters on a crowded phone board where every extra second of heat puts nearby capacitors, resistors, and underfilled chips at risk. The paste works in a 183℃ to 210℃ range, which places it in the medium-temperature class and gives you a practical middle ground: the joint holds firmly for handling, testing, and reassembly, while you avoid the high heat that lifts neighbouring pads or damages flex connectors. For a heat-sensitive area that needs an even lower melting point, Mechanic offers the iSm3 at 138℃ as a companion option, and many technicians keep both syringes on the bench. The iSm5 fills the pad fully, so the finished solder point looks round and complete rather than thin or grainy, and the residue stays clear and transparent. Clear residue sounds like a small detail until you try to align a hair-thin jumper under a microscope, where cloudy flux hides the wire path and forces you to guess where the next joint sits. With the iSm5 you see the copper, the wire, and the pad clearly, so you shift and align the flying line with confidence. The paste earns its place on stubborn jobs too: after you remove underfill glue from a chip, the exposed pads often refuse to take solder, and the high-activity formula helps them accept tin again without aggressive scraping. The same strength helps on untinned circuit boards, external pin chips, battery connector pads, and charging port pads where old solder, glue, or corrosion blocks a clean joint. In a typical Pakistani repair shop, this paste becomes the go-to consumable for fingerprint not working complaints, charging issue cases where a torn charging port pad breaks the path, dead phone cases where an open line cuts the power supply, and network issue repairs where a lifted RF trace needs a bridge. It also suits the fine wires you solder onto ISP pinout points when you program eMMC or UFS storage on a dead board. Your workflow stays simple: clean the area, expose the copper with a scraper or fiberglass pen, place a small amount of iSm5 on each end point, tin the pads with your soldering station, lay the jumper wire, and touch each end once. Check the line with a multimeter in continuity mode, then seal the repair with UV solder mask so the wire stays protected. The pack includes three dispensing needles, which let you control the quantity precisely and switch to a clean needle when one clogs. For a complete jumper setup, pair the paste with a fine-tip soldering station, a stereo microscope, a PCB holder to keep the board steady, and a hot air station for removing shields and chips before the trace work begins. KB GSM Store supplies the Mechanic iSm5 to repair shops, service centres, and training institutes across Pakistan, so you keep a reliable jumper paste in stock and close board-level jobs faster with fewer customer returns.

Key Features

  • Dedicated jump wire formula built for flying line and trace repair on phone motherboards
  • Nano compound formulation delivers a high activity factor for fast wetting on oxidized pads
  • Medium-temperature working range of 183℃–210℃ for firm joints with controlled heat
  • Moderate viscosity keeps each dab in place on tiny solder points
  • Single-touch tinning with the iron tip reduces heat exposure on nearby components
  • Fills the pad fully for round, complete solder points
  • Clear, transparent residue keeps the wire path visible for easy alignment
  • 3ML syringe with three dispensing needles for precise quantity control

Specifications

Brand Entity Mechanic
Product Entity Mechanic iSm5 Jump Wire Specific Solder Paste (3ML)
Technology Entity Nano compound high-activity solder paste, medium-temperature (183℃–210℃) soldering
Compatible Device Entities Mobile phone motherboards, iPhone fingerprint lines, laptop and computer motherboards
Repair Process Entity Jumper wire soldering, flying line repair, pad tinning, trace repair, micro soldering
Industry Entity Mobile phone repair, PCB repair, board-level electronics repair

Compatible Devices

  • Universal — not device-specific; works on mobile phone motherboards of all brands
  • iPhone fingerprint (Touch ID) flying line repair
  • Laptop motherboards
  • Computer motherboards and general PCB boards

Common Repair Uses

  • Jumper wire and flying line soldering on broken or lifted traces
  • Fingerprint line repair
  • Re-tinning pads that refuse solder after chip underfill removal
  • Battery connector pad repair
  • Charging port (tail plug) pad repair
  • Soldering external pin chips
  • Tinning untinned circuit boards

FAQ

What is the product name?
The product name is Mechanic iSm5 183℃ Specific Paste For Jumper Wire.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is iSm5.
What is this product used for?
This product is used for jumper wire, flying line, and pad tinning work during mobile phone motherboard repair.
Which devices are compatible with this product?
This product is compatible with mobile phone, laptop, and computer motherboards universally, as it is a soldering consumable rather than a device-specific part.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What temperature does the Mechanic iSm5 jumper paste work at?
The iSm5 works in a 183℃–210℃ range, which makes it a medium-temperature paste. For lower-heat jobs, Mechanic offers the iSm3 at 138℃.
Does the iSm5 help on pads that will not take solder after underfill removal?
Yes. Its high-activity nano compound formula helps stubborn pads accept tin again after you remove chip underfill glue, and it also works on untinned boards and oxidized battery or charging port pads.