Skip to product information
1 of 4
Brand: MECHANIC

Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk)

Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk)

Regular price Rs.800.00 PKR
Regular price Sale price Rs.800.00 PKR
Sale Sold out
Shipping calculated at checkout.
Quantity

The Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk) is a dedicated reballing template for the storage chip on Apple iPhone logic boards. When a phone hangs on the logo, fails a restore, or goes dead after a NAND swap, you need clean, even solder balls on the hard disk chip before it goes back on the board. This iTin-series stencil gives you an aperture layout made for NAND/PCIe storage chips, so you can print paste, heat, and get uniform balls without guesswork. It fits naturally into your hot air and reballing workflow for board-level iPhone storage repair in any Pakistani repair shop.

SKU:MST-SOLDERING-TOOLS-270

⚖️ Weight: 0.9 kg

  • Safe & Secure Payment
  • Fast Delivery
  • WhatsApp Support
View full details

Description

An iPhone that sits on the Apple logo, throws a restore error in iTunes, or goes into a boot loop after a drop often points you toward the storage chip, and the Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk) gives you the right template to bring that chip back to the board with proper solder balls. Every board-level technician knows the NAND job does not end at removal; the real test comes when you put the chip back, because one weak ball or one bridged pad turns a repairable phone into a dead phone with no display and no DFU response. This stencil belongs to Mechanic's numbered iTin series for Apple iPhone boards, and model 19 carries the NAND/PCIe hard disk layout, so you reach for one dedicated plate instead of hunting through a universal sheet and hoping the pitch lines up. The workflow on your repair bench stays simple: lift the hard disk chip with your hot air station, clean the old solder off the chip with flux and wick using your soldering station, align the chip under the matching cutout, print paste across the apertures, and heat until the balls form evenly. A good PCB holder keeps the board steady while you work, and a stereo microscope lets you check every ball for size and shape before you reflow the chip back onto the logic board. Pakistani workshops see this job daily in Lahore, Karachi, and Islamabad: a customer brings a phone with a hardware fault after a failed update, another shop has already tried software and declared it a hardware issue, and now the phone reaches the shop owner who handles board work. NAND reballing also comes up when you upgrade storage or replace a damaged chip, since the new or reprogrammed chip needs fresh balls before it goes down. Pair this plate with a NAND programmer from our eMMC Programmers and test tools range when the job involves reading or writing the chip, because a storage swap on an iPhone usually needs the original board data written to the replacement chip before the phone boots. Keep a multimeter nearby to check the supply lines around the storage section before you blame the chip itself, since a shorted line can mimic a NAND failure and waste your stencil work. The iTin 19 suits technicians at every stage of growth; a shop that starts with basic chip replacement can move up from this plate to full reballing kits, ISP pinout tools for data jobs, and UFS adapters for Android storage work, building a complete storage repair station over time. Treat the stencil with care and it stays useful for many jobs; clean it after every use with alcohol and a soft brush so dried flux and leftover paste do not block the small apertures, and store it flat so the plate does not bend. A clean, flat stencil holds the chip tight against the template, which keeps paste from spreading under the plate and joining neighbouring balls. Choose a paste that matches your heat profile, and keep your hot air nozzle moving so the plate heats evenly instead of warping in one spot. If you run a service center with several technicians, keeping dedicated numbered stencils like the iTin 19 at each bench saves time, because nobody waits for one shared universal plate. Price in Pakistan stays budget-friendly for a tool that saves you from sending NAND jobs out to another shop, so every successful reball keeps that repair income in your own workshop. For mobile repair technicians, GSM hardware engineers, and training institutes teaching iPhone board repair, this stencil covers one of the most common chip-level jobs in the iPhone repair process and fits straight into the soldering and rework stage of your workflow. Order it from KB GSM Store alongside your hot air stations, soldering stations, reballing kits, and PCB holders, and keep your NAND repairs moving without delay.

Key Features

  • Dedicated aperture layout for iPhone NAND/PCIe hard disk chips, so you skip trial-and-error with universal sheets
  • Part of the numbered Mechanic iTin series, which makes stencil selection fast on a busy repair bench
  • Supports the solder paste print-and-heat reballing method used for BGA storage chips
  • Works with standard hot air stations for chip removal, ball forming, and reflow
  • Single focused plate keeps the storage job separate from CPU and baseband stencils in your kit
  • Pairs with NAND programmers when a storage swap requires reading or writing chip data
  • Reusable across many jobs when you clean the apertures after each use
  • Suitable for repair shops, service centers, and training institutes doing iPhone board-level repair

Specifications

Brand Entity Mechanic
Product Entity Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk)
Technology Entity BGA reballing, NAND flash storage, PCIe storage interface
Compatible Device Entities Apple iPhone logic boards (NAND/PCIe hard disk chip)
Repair Process Entity NAND chip removal, reballing, chip reflow, board-level storage repair
Industry Entity Mobile phone repair, PCB repair, micro-soldering

Compatible Devices

  • Apple iPhone NAND/PCIe hard disk (storage) chips
  • Mechanic iTin series coverage for Apple iPhone logic boards
  • Match the chip footprint to the stencil cutout before use; exact model coverage depends on the NAND package on your board

Common Repair Uses

  • Reballing the NAND/PCIe hard disk chip after removal from an iPhone logic board
  • Preparing a new or replacement storage chip before mounting it on the board
  • Storage chip reflow and reballing for phones hanging on the Apple logo or failing restore
  • NAND storage upgrade jobs that need fresh solder balls on the replacement chip
  • Board-level hardware fault repair in the storage section

FAQ

What is the product name?
The product name is Mechanic iTin 19 BGA Stencil (NAND/PCIE hard disk).
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is iTin 19.
What is this product used for?
This product is used for reballing NAND/PCIe hard disk (storage) chips on Apple iPhone logic boards.
Which devices are compatible with this product?
This product is compatible with Apple iPhone NAND/PCIe hard disk chips covered by the Mechanic iTin series layout.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can I use solder paste with the Mechanic iTin 19 stencil?
Yes. You place the chip under the matching cutout, spread solder paste across the apertures, and heat with hot air until the balls form, then remove the chip from the stencil.
Do I need a programmer when I replace the NAND chip on an iPhone?
In most cases yes. A replacement or swapped storage chip needs the original board data written to it with a NAND programmer before the phone boots normally; the stencil handles the reballing step only.

Ask any Query