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Mechanic Micro-Carving Laser Machine – Fiber Laser Back Glass & PCB Engraving Tool

Mechanic Micro-Carving Laser Machine – Fiber Laser Back Glass & PCB Engraving Tool

Regular price Rs.85,000.00 PKR
Regular price Sale price Rs.85,000.00 PKR
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The Mechanic Micro-Carving Laser Machine is a fiber laser tool built for back glass removal, screen-to-frame separation, and precision PCB or IC engraving on modern smartphones. It runs on a 1064nm fiber laser source with a 175mm x 175mm marking range, giving technicians enough working area for full smartphone components and small tablet parts. Red light focus with dual-dot alignment speeds up height calibration, while the dedicated control software carries an updatable phone blueprint library so the laser path stays clear of cameras and sensors. Built-in air cooling supports continuous use without thermal shutdown, and the aluminum alloy chassis keeps the laser head steady during high-speed work. It replaces heat guns and manual scraping for back glass jobs and gives board-level technicians a clean way to etch or mark ICs before removal.

SKU:MST-SOLDERING-TOOLS-1410

⚖️ Weight: 12.0 kg

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Description

The Mechanic Micro-Carving Laser Machine changes how a repair bench handles back glass removal, screen separation, and board-level marking work by replacing heat, scraping, and guesswork with a controlled fiber laser beam. At the core of the machine sits a high-frequency fiber laser source running at a 1064nm wavelength, a wavelength chosen because it reads metal and PCB surfaces cleanly while also breaking down the cold-press adhesive layers used under smartphone back glass, camera lens covers, and mid-frame glass panels. Rather than heating a panel until the glue softens, the laser carbonizes the adhesive layer directly underneath the glass, so the glass lifts away without transferring heat into the wireless charging coil, the flex cables, or the frame sensors sitting close by. That non-contact approach matters most on flagship devices where a slipped scraper or an overheated frame turns a routine back glass swap into a board repair. On the board side, the same laser head handles IC and shielding can etching, marking a chip for identification or thinning a shielding can so it lifts off without dragging solder pads or neighboring components with it. Technicians working reballing and IC change jobs get a way to prep a board before touching it with a hot air station, cutting down on the trial-and-error that usually comes with cutting or prying a shield by hand. The marking range covers 175mm x 175mm, wide enough for a full smartphone back panel, a mid-frame, or a cluster of ICs on a motherboard without repositioning the workpiece mid-job. Positioning relies on red light focus paired with dual-dot alignment, a setup built to get height calibration right in seconds rather than the slow manual jogging older laser units require. A digital offset correction layer sits behind that alignment step, matching the laser path against factory reference data so repeat jobs land in the same spot every time instead of drifting after a few uses. Running the machine day-to-day goes through a dedicated control software package rather than a fixed set of preprogrammed cuts. The software carries a blueprint library covering current iPhone, Samsung, and Huawei frame and back glass geometries, and that library updates over time as new device models reach the market, which keeps a shop from needing a new machine every time a new flagship launches. Because the blueprints map out exactly where the camera lens, flash module, and wireless charging coil sit, the laser path stays clear of those zones automatically, cutting the risk of a technician eyeballing a cut too close to a sensor. Frame and glass compatibility currently runs from the iPhone X body style through the iPhone 16 Pro Max for screen and frame separation work, and from iPhone 8 through iPhone 16 Pro Max for rear glass panel removal, with the newest Pro-series frames carrying a 0.2mm flexible section where drilling operations are best avoided even though laser separation still applies. Continuous operation on a busy repair bench depends on heat management, and the machine handles that with a built-in high-speed air cooling system that keeps the laser diode within its working temperature range through back-to-back jobs, avoiding the mid-shift thermal shutdowns that slow down lower-grade laser units. Power comes through a universal AC 110V-220V input, so the machine drops into a Pakistani repair shop's existing power setup without a separate transformer or voltage conversion step. The chassis itself uses a heavy-duty aluminum alloy build, giving the laser head a vibration-free platform during high-speed engraving passes, which matters directly for engraving accuracy since even small chassis flex shows up as a wavy or off-center cut on the finished panel. Inside a repair shop's workflow, this machine sits at the diagnostics-to-disassembly stage for back glass and frame jobs, and at the board-prep stage for IC and PCB work, meaning it usually comes into play right after a dead phone or display problem gets traced to a hardware fault that needs the back cover or a shielded chip exposed. For a service center handling volume, cutting a 45-minute manual back glass removal down to a 10-15 minute automated pass changes how many boards or panels a single technician can move through in a shift, and the one-button start with automatic focusing means a newer technician can run the machine safely without months of manual scraping experience behind them. Beyond repair work, the same laser head doubles as a branding tool, engraving logos, serial numbers, or custom text onto metal frames, plastic housings, and leather accessories, which gives a shop a way to offer a paid customization service on top of standard repair jobs using equipment that's already on the bench. For a shop weighing this against a heat gun and manual scraper setup, the trade-off comes down to consistency: a laser path guided by verified blueprints repeats the same result panel after panel, while manual removal depends on how steady a given technician's hands are that day, and that consistency is usually what separates a shop that can safely offer premium refurbishment work from one that sticks to basic repairs.

Key Features

• High-frequency fiber laser source for stable, ultra-fine beam output
• 1064nm wavelength tuned for metal marking and adhesive breakdown
• 175mm x 175mm marking range covers full smartphone panels and small tablet components
• Red light focus with dual-dot alignment for fast, accurate height calibration
• Digital offset correction matches factory reference data for repeatable cuts
• Dedicated control software with an updatable phone blueprint library
• Built-in high-speed air cooling for continuous operation without thermal shutdown
• Universal AC 110V-220V power supply and aluminum alloy chassis for a vibration-free work surface

Specifications

Brand Entity Mechanic
Product Entity Micro-Carving Laser Machine
Technology Entity Fiber laser engraving technology
Compatible Device Entities iPhone X through iPhone 16 Pro Max, general Android and iOS motherboards
Repair Process Entity Back glass removal, screen-to-frame separation, IC and shielding can etching, PCB marking
Industry Entity Mobile repair and PCB rework industry

Compatible Devices

iPhone X through iPhone 16 Pro Max for screen and frame separation, iPhone 8 through iPhone 16 Pro Max for rear glass panel removal, and general Android/iOS motherboards and ICs for laser marking work through the software's blueprint library. Drilling is not recommended on iPhone 15 Pro, 15 Pro Max, 16 Pro, and 16 Pro Max frames due to their 0.2mm flexible sections.

Common Repair Uses

Back glass removal on flagship smartphones, screen and mid-frame separation, camera lens glass removal, IC and shielding can etching for identification or removal, PCB component marking, and custom engraving on metal frames, plastic housings, and accessories.

FAQ

What is the product name?
The product name is the Mechanic Micro-Carving Laser Machine.
What is the brand of this product?
The brand of this product is Mechanic.
What is this product used for?
This machine is used for back glass removal, screen-to-frame separation, IC and shielding can etching, and PCB or metal engraving on mobile devices.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does this laser machine support back glass removal on iPhone 15 Pro and 16 Pro models?
Yes, laser separation works on these frames, though drilling operations are not recommended due to their 0.2mm flexible frame sections.
What laser wavelength does the Mechanic Micro-Carving Machine use for PCB and IC marking?
It uses a 1064nm fiber laser wavelength, which is optimized for metal marking and adhesive breakdown without affecting surrounding board components.

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