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Brand: MECHANIC

Mechanic MK1 SE Universal Fixture

Mechanic MK1 SE Universal Fixture

Regular price Rs.3,500.00 PKR
Regular price Sale price Rs.3,500.00 PKR
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The Mechanic MK1 SE Universal Fixture gives your repair bench a solid, heat-proof base for motherboard and IC-level work. Its 50mm large-stroke clamping area grips phone logic boards, CPUs, baseband chips, storage ICs, and power ICs firmly while you scrape old solder, remove underfill glue, or reball a chip. The nano-composite synthetic stone body withstands temperatures up to 500°C, resists static and corrosion, and keeps its shape under constant hot air use. A quadrilateral non-blocking slot lets you clean the whole chip without repositioning it, so you finish glue removal and de-tinning in one clean pass. A smart pick for Pakistani repair shops handling dead phone and CPU replacement jobs every day.

SKU:MST-SOLDERING-ACCESSORIES-803

⚖️ Weight: 0.35 kg

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Description

Every CPU swap, eMMC replacement, or baseband reball starts with one question at the bench: will the board or chip stay put when the heat and the blade arrive? The Mechanic MK1 SE Universal Fixture answers that question with a 50mm large-stroke clamping area that grips a full phone motherboard or a single loose IC with the same steady pressure. Mechanic builds the body from a nano-composite synthetic stone material that tolerates temperatures up to 500°C, so you can aim your hot air station directly at the work area without warping the holder or losing grip halfway through a job. The same material resists static buildup and corrosion, which protects sensitive memory and processor chips during long sessions, and its wear-resistant surface holds up to the daily scraping a busy Pakistani repair shop puts it through. The clamping jaws handle mobile phone CPUs, baseband ICs, storage chips, power supply ICs, tablet processors, and even computer CPUs, graphics memory chips, and GPUs, so one fixture covers most of the chip-level work that reaches your counter. Where this tool really earns its place is underfill and glue removal. Modern Android and iPhone logic boards bond the CPU and memory stack with epoxy underfill, and cleaning that layer after an IC change takes patience and a stable grip. The MK1 SE uses a dedicated chip de-gumming slot and a quadrilateral non-blocking slot layout, so your blade or scraper moves across all four edges of the chip without hitting a jaw. You skip the constant loosening, rotating, and re-clamping that older holders force on you, and you clean the whole chip surface in one go. A deepened concave groove with offset fixing angles supports the chip precisely while leaving clearance underneath, which helps prevent chip deformation from excessive heat during rework. In real shop terms, think about a dead phone that arrives after a failed software flash, or a handset stuck on hang on logo where your diagnosis points to a faulty eMMC or UFS chip. You lift the storage chip with hot air, clamp it in the MK1 SE, remove the old glue and solder, reball it with a stencil from your reballing kits, and then program or repair it through your eMMC programmers, UFS adapters, or ISP pinout tools. The fixture sits at the center of that workflow because every step between removal and reinstallation needs a flat, locked, heat-safe base. The same logic applies when you tackle a charging issue that points to a power IC, a network issue that leads back to the baseband, or a boot loop that ends in a CPU replacement. Pair it with a soldering station for tinning pads, a microscope for inspecting ball alignment, and a multimeter for checking lines before and after the job. Technicians who already own standard PCB holders for board-level work often add the MK1 SE specifically for chip cleaning and CPU jobs, since a regular board clamp rarely offers the clearance or heat tolerance that direct IC work demands. If you run test boxes for software repair and want to move into hardware-level chip work, this fixture makes a practical first upgrade because it removes the most frustrating part of the job: chasing a sliding chip across the mat. The unit ships as a single fixture with a gross weight of about 280 grams, light enough to move around the bench yet solid enough to stay stable during scraping. It carries no brand or model restriction, so it works with boards and chips from any manufacturer as long as they fit within the 50mm clamping range. For repair shops, service centers, and training institutes in Pakistan that handle chip-level repair every day, the Mechanic MK1 SE Universal Fixture turns glue removal, de-tinning, and reballing into a faster and cleaner routine, and it protects the expensive chips you cannot afford to damage.

Key Features

  • 50mm large-stroke clamping area holds full motherboards as well as individual loose chips
  • Nano-composite synthetic stone body withstands temperatures up to 500°C during hot air and soldering work
  • Anti-static and anti-corrosion material protects sensitive CPU, memory, and baseband chips
  • Wear-resistant surface stands up to repeated scraping and daily workshop use
  • Dedicated chip de-gumming slot gives a larger, steadier grip for underfill glue removal
  • Quadrilateral non-blocking slot lets you clean all four chip edges without changing orientation
  • Deepened concave groove with offset fixing angles supports the chip precisely and helps prevent heat deformation
  • Universal design clamps phone CPUs, baseband ICs, storage chips, power ICs, tablet CPUs, computer CPUs, and GPUs

Specifications

Brand Entity Mechanic
Product Entity Mechanic MK1 SE Universal Fixture (PCB and IC chip clamping fixture)
Technology Entity 50mm large-stroke clamping, quadrilateral non-blocking de-gumming slot, nano-composite synthetic stone heat-resistant body
Compatible Device Entities Mobile phone motherboards, phone and tablet CPUs, baseband ICs, eMMC/UFS storage chips, power supply ICs, computer CPUs, graphics memory chips, GPUs
Repair Process Entity Underfill glue removal, de-tinning, IC reballing, CPU replacement, chip-level soldering and desoldering
Industry Entity Mobile phone repair, PCB repair, board-level and IC-level electronics repair

Compatible Devices

  • Universal — not device-specific; fits any board or chip within the 50mm clamping range
  • Mobile phone motherboards and logic boards
  • Mobile phone and tablet CPUs
  • Baseband / modem ICs
  • Storage chips (eMMC, UFS, and similar memory ICs)
  • Power supply ICs
  • Computer CPUs, graphics memory chips, and GPUs

Common Repair Uses

  • Removing epoxy underfill glue from CPU and memory chips after removal
  • De-tinning and cleaning old solder from IC pads before reballing
  • Holding chips steady during stencil reballing
  • CPU replacement and CPU swap jobs on dead phone boards
  • Preparing eMMC/UFS chips for programming or reinstallation in hang on logo and boot loop repairs
  • Clamping motherboards during hot air soldering and desoldering of ICs
  • Baseband and power IC rework for network issue and charging issue repairs

FAQ

What is the product name?
The product name is Mechanic MK1 SE Universal Fixture.
What is the brand of this product?
The brand of this product is Mechanic.
What is the model of this product?
The model of this product is MK1 SE.
What is this product used for?
This product is used for clamping phone motherboards and IC chips during glue removal, de-tinning, reballing, soldering, and CPU replacement work.
Which devices are compatible with this product?
This product is compatible with any motherboard or chip that fits within its 50mm clamping range, including phone and tablet CPUs, baseband ICs, storage chips, power ICs, computer CPUs, graphics memory chips, and GPUs.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What temperature can the Mechanic MK1 SE Universal Fixture handle during hot air rework?
The fixture uses a nano-composite synthetic stone material that withstands temperatures up to 500°C, so you can apply hot air directly to the clamped board or chip without damaging the holder.
Do I need to reposition the chip while removing underfill glue from all sides?
No. The quadrilateral non-blocking slot design keeps all four edges of the chip clear, so you can scrape glue and solder from every side in one pass without loosening or rotating the chip.